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Adhesion sheet and preparation method thereof, and copper clad laminate using adhesion sheet

A technology for copper clad laminates and adhesive sheets, applied in the field of copper clad laminates, can solve the problems of poor fluidity, poor heat resistance, and high manufacturing costs, and achieve the effects of reducing costs, low dielectric loss, and improving toughness

Pending Publication Date: 2019-11-05
AAC TECH NANJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention mainly solves the technical problems of poor heat resistance, poor fluidity and high manufacturing cost of the existing adhesive sheet. The present invention provides an adhesive sheet, its preparation method and a copper-clad laminate using the adhesive sheet

Method used

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  • Adhesion sheet and preparation method thereof, and copper clad laminate using adhesion sheet
  • Adhesion sheet and preparation method thereof, and copper clad laminate using adhesion sheet
  • Adhesion sheet and preparation method thereof, and copper clad laminate using adhesion sheet

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preparation example Construction

[0048] The present invention also provides a preparation method of an adhesive sheet, specifically comprising the following steps:

[0049] Step S1, weighing the following components according to the parts by mass: 25-65 parts of matrix resin, 20-60 parts of fiber reinforcement, 10-40 parts of filler and 0-15 parts of flame retardant;

[0050]In this step, the types of the matrix resin, fiber reinforcement, filler and flame retardant are the same as those used in the above-mentioned adhesive sheet, and will not be repeated here.

[0051] Step S2, adding the matrix resin, filler and flame retardant into an appropriate solvent, and mixing uniformly to form a glue;

[0052] In this step, the solvent used is determined according to the types of the matrix resin, filler and flame retardant. Mixing can be carried out at a certain temperature, accompanied by stirring, which is conducive to uniform mixing.

[0053] Step S3, immersing the fiber reinforcement in the glue;

[0054] In...

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Abstract

The present invention provides an adhesion sheet, which comprises, by mass, 25-65 parts of a matrix resin, 20-60 parts of a fiber reinforcement body, 10-40 parts of a filler, and 0-15 parts of a flameretardant, wherein the matrix resin comprises, by mass, 20-70 parts of modified polyphenylene ether, 30-70 parts of a polydiolefin type polymer, and 0-5 parts of an initiator. The present invention further provides a preparation method of the adhesion sheet, and a copper clad laminate using the adhesion sheet. According to the present invention, the heat resistance of the adhesion sheet and the copper clad laminate can reach more than 200 DEG C, such that the problems of defects, delamination and the like generated in the processing of the multilayer copper clad laminate due to insufficient heat resistance of the adhesion sheet can be solved; the fluidity of the adhesion sheet is maintained at 5-15%, such that the sufficient flowing and filling of the resin in the preparation process of the multi-layer copper clad laminate can be ensured, and the quality and the batch stability of the product can be ensured; and the cured adhesion sheet has low dielectric loss so as to meet the needsof the future high frequency field.

Description

【Technical field】 [0001] The invention relates to the technical field of adhesive sheets, in particular to an adhesive sheet, a preparation method thereof and a copper-clad laminate using the adhesive sheet. 【Background technique】 [0002] Copper-clad laminate fabrication often requires the use of adhesive sheets to bond two or more layers of material together under heat and / or pressure. In use, the adhesive sheet or portion thereof can flow and completely fill a space and provide a bond between circuits, between a circuit and an electrical layer, between two conductive layers, or between a circuit and a dielectric layer. The adhesive sheet has electrical, thermal and mechanical properties (including low dielectric constant and low dissipation factor) comparable to the materials of the individual layers. The existing adhesive sheets are mainly prepared by blending modified polyphenylene ether and polyolefin. Due to the large difference in structure between polyphenylene eth...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/10C09J7/30C09J125/02C09J171/12C09J11/04B32B15/08B32B15/20B32B27/18B32B27/20B32B27/28B32B27/32
CPCB32B15/08B32B15/20B32B27/18B32B27/20B32B27/285B32B27/32B32B2260/046B32B2457/08C08K2201/003C08K2201/011C08L2201/08C09J11/04C09J125/02C09J171/12C09J7/10C09J7/30C08L71/12C08K9/06C08K7/18C08K7/00C08K7/14C08L25/02
Inventor 王宏远王和志张翼蓝
Owner AAC TECH NANJING
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