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Novel terahertz temperature-controlled adjustable multi-frequency metamaterial absorber

A terahertz and metamaterial technology, applied in the field of new terahertz temperature-controlled multi-frequency metamaterial absorbers, can solve the problems of complex and different metamaterial absorbers, and achieve stable physical properties and not easy to damage. Effect

Inactive Publication Date: 2019-11-12
ZHONGBEI UNIV
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Problems solved by technology

The preparation of traditional electromagnetic absorbing coating materials is relatively complicated, but metamaterial absorbers are different

Method used

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  • Novel terahertz temperature-controlled adjustable multi-frequency metamaterial absorber
  • Novel terahertz temperature-controlled adjustable multi-frequency metamaterial absorber
  • Novel terahertz temperature-controlled adjustable multi-frequency metamaterial absorber

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Embodiment Construction

[0025] A novel terahertz temperature-controlled tunable metamaterial wave absorber, the design idea of ​​which includes the following steps:

[0026] Combined with the traditional "sandwich" absorbing structure, replace the original dielectric layer with temperature-controllable InSb material, then sputter the metal plate at the bottom, and prepare the metal unit structure on the upper surface. The specific process is as follows : First, the InSb thin film is prepared by the three-temperature zone method, and then the underlying metal plate is prepared by magnetron sputtering, and the metal unit is prepared by the MEMS metal lift-off process.

[0027] InSb thin film is a semiconductor thin film with high electron mobility. Vacuum coating technology is used here to prepare InSb thin films on silicon wafers. During the preparation process, inert gases such as nitrogen and helium are used for protection, and the three-temperature zone method is used to control the temperature of...

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Abstract

The invention relates to design and preparation of a novel terahertz temperature-controlled adjustable multi-frequency metamaterial absorber. The design idea includes the following steps: according tothe current development status of a temperature-control material, InSb is selected as a metamaterial absorber dielectric substrate, and according to a Drude model, the relative dielectric constant issubjected to approximate calculation and extraction; based on the traditional sandwich absorbing structure design principle, a finite-difference time-domain method is used for modeling and simulationto design a metamaterial metal unit formed by combing polarization-insensitive L-shaped four corners and a middle built-in zigzag structure, and finally, a magnetron sputtering process and a metal stripping process are carried out for sample preparation. The multi-frequency temperature-controlled metamaterial unit design and process preparation is the core technology, and in comparison with the traditional absorbing material, more absorbing frequency bands are achieved, the flexibility is better, and the manufacturing accuracy is higher.

Description

technical field [0001] The invention relates to the preparation of a metamaterial wave absorber, in particular to a novel terahertz temperature-controlled adjustable multi-frequency metamaterial wave absorber, which includes the metamaterial structure design and metal stripping process preparation technology. Background technique [0002] Electromagnetic stealth technology is a research hotspot in the current military field. The commonly used stealth method of weapons and equipment is to add coatings on its surface, such as ferrite coatings, which are relatively cheap compared to other wave-absorbing coating materials and have relatively general effects; weight increase. A revolution is gradually being brought about in this field with the rise of metamaterials, which are artificially designed composite electromagnetic materials with special structures. Using metamaterials as a wave absorber can achieve more than 90% of the electromagnetic wave absorption effect in the corr...

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Application Information

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IPC IPC(8): H05K9/00
CPCH05K9/0081
Inventor 屈增段俊萍张斌珍徐永庆
Owner ZHONGBEI UNIV
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