Tail gas treatment device

Abstract

The invention provides a tail gas treatment device, which comprises a shell, an air inlet part, an exhaust part, and a filter part and a bracket part that are arranged in the shell. In a direction from the top of the shell to the bottom of the shell, the tail gas treatment device is provided with N sub-filter parts with successively increasing filter apertures, so that in the movement process of to-be-treated exhaust gas from the bottom to the top of the tail gas treatment device, the filter part can intercept solid particles of different particle sizes in the to-be-treated exhaust gas in order, thus reducing the resistance of the gas running process, reducing the energy consumption and maintenance frequency of a vacuum pump, and being conducive to improving the production efficiency. In addition, a bottom bracket of the bracket part makes the lower end face of the filter part higher than the top horizontal plane of an air inlet, and the radial dimension of each sub-filter part fits the inner diameter of the shell, thereby guaranteeing effective filtering treatment on all the to-be-treated exhaust gas.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to an exhaust gas treatment device. Background technique [0002] In the manufacturing process of silicon wafers for solar cells, taking the Atomic Layer Deposition (ALD) process as an example, two or more precursor gases are introduced into the process chamber under flow control and pulse control, and the process chamber Control the temperature and pressure to cause physical adsorption and surface chemical reaction on the surface of the substrate to control the thickness and uniformity of the generated functional film, such as field-effect passivation film such as aluminum oxide or silicon oxide, and effectively compensate for the defects on the substrate surface . [0003] However, since the deposition reaction is carried out under vacuum conditions, the products and by-products generated by the chemical reaction between the precursors, as well as solid particles...

AI Technical Summary

Problems solved by technology

However, the filter screens of each layer of the particle collection device are 80 mesh specifications. Once the average particle size distribution of solid particles in the exhaust gas is very wide, and the discharge volume increases, the gas will flow through the exhaust gas from bottom to top under the action of the vacuum pump. The resistance encountered in the process of filtering the screen increases significantly, thereby increasing the energy consumption of the vacuum pump and affecting the service life of the vacuum pump

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