Ultra-low resistance precision chip resistor and manufacturing method

A precision chip, resistor technology, used in resistors, resistor manufacturing, resistor parts and other directions

Inactive Publication Date: 2019-11-15
BEIJING 718 YOUSHENG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, the resistors produced by the above three processes cannot process ultra-low resistance precision chip resistors with a resistance value below 10mΩ, an accuracy higher than ±1%, and a temperature coefficient less than ±100ppm / K.

Method used

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  • Ultra-low resistance precision chip resistor and manufacturing method
  • Ultra-low resistance precision chip resistor and manufacturing method
  • Ultra-low resistance precision chip resistor and manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] The manufacturing method of the ultra-low resistance precision chip resistor:

[0033] 1. Make heat dissipation chip strips: use laser cutting technology to cut aluminum strips, cut out Figure 1-a with Figure 1-b The heatsink chip strap shown;

[0034] 2. Making resistance chip strips: use laser cutting technology to cut the alloy strips, and cut out Figure 2-a with Figure 2-b The resistor chip strip shown;

[0035] 3. Make plastic-encapsulated resistance strips: Insulate and bond the resistance chip strips and heat-dissipating chip strips, and put them into the plastic packaging mold for positioning. After the positioning is completed, start the plastic packaging equipment, and plastic seal the Figure 3-a with Figure 3-b The plastic-encapsulated resistance strip shown;

[0036] 4. Make the logo resistance tape: Put the plastic-encapsulated resistance tape into the designated position of the laser marking machine, turn on the laser marking machine, and proces...

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Abstract

The invention provides an ultra-low resistance precision chip resistor and a manufacturing method, which belong to the field of ultra-low resistance resistors. According to the invention, an alloy material with suitable resistivity and free temperature coefficients is selected as a resistance layer according to parameters such as product size, resistance value and temperature coefficient; a lasercutting process is used to cut a pre-designed resistance pattern on an alloy strip; laser resistor trimming is used to adjust the resistance of a resistor chip; an aluminum foil is used as a heat dissipation chip material to form a heat dissipation chip through laser cutting; the resistor chip and the heat dissipation chip are assembled and plastically packaged to form an encapsulation layer; theencapsulation layer is laser-marked to form a mark; and copper, nickel and tin lead are plated at electrode locations to form terminals. According to the invention, the production of the ultra-low resistance precision chip resistor which is below 10 m omega and has precision more than + / -1% and a temperature coefficient less than + / -100 ppm / K is achieved, which fills the market gap.

Description

[0001] 1. Technical field [0002] The invention relates to a surface mounted ultra-low resistance precision chip resistor and a manufacturing method. [0003] 2. Background technology [0004] Generally, chip resistors are divided into three types, namely chip thick film resistors, chip thin film resistors and chip alloy foil resistors. [0005] The chip thick film resistor is to print the positive and the back electrodes on the ceramic substrate, and then print the resistive film layer between the positive electrodes, adjust the resistance precision by laser cutting, then print the dielectric film layer and text, and then print or The positive and the back electrodes are connected by sputtering, and finally a nickel barrier layer and a tin-lead solderable layer are electroplated on the electrodes. [0006] Chip thin film resistors print positive and negative electrodes on the ceramic substrate, then evaporate or sputter a layer of metal film between the positive electrodes, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01C3/12H01C1/084H01C1/02H01C1/04H01C1/14H01C17/02H01C17/242H01C17/28
CPCH01C1/02H01C1/04H01C1/084H01C1/14H01C3/12H01C17/02H01C17/242H01C17/28
Inventor 曾炀周向辉李强唐雪松宋文君刘斯琦李安琦包桂千
Owner BEIJING 718 YOUSHENG ELECTRONICS
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