Copper-based material surface icing-delaying structure and preparation method thereof

A copper-based, copper-based technology, applied in the field of copper-based material surface delayed icing structure and its preparation, can solve the problems of work efficiency impact, reduced practical rate, copper-based material surface performance can not meet the requirements of specific working conditions, etc., to achieve Effect of increased roughness, increased contact area, and good icing delay performance

Pending Publication Date: 2019-11-22
CHANGCHUN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, people's requirements for the use and process performance of copper-based materials continue to increase, which makes the surface properties of more and more traditional copper-based materials unable to meet the requirements of specific working conditions.
For example, in the air with sub-zero temperature, a layer of frost will quickly condense on the surface of copper-based materials, which will affect its working efficiency and reduce its practical rate.

Method used

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  • Copper-based material surface icing-delaying structure and preparation method thereof
  • Copper-based material surface icing-delaying structure and preparation method thereof
  • Copper-based material surface icing-delaying structure and preparation method thereof

Examples

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Effect test

Embodiment 1

[0018] Step 1: Prepare the copper-based material into a size of 20mm×10mm×2mm by wire cutting; then polish the cut copper substrate on 600-mesh, 1000-mesh, 1500-mesh, and 2000-mesh sandpaper to make the surface smooth;

[0019] Step 2: Polish the copper substrate on a polishing machine to make the surface of the substrate smooth; then place the copper substrate in alcohol for ultrasonic cleaning for 5 minutes; dry the cleaned copper substrate briefly, and observe the surface whether it is cleaned;

[0020] Step 3: Prepare a concave matrix structure on the surface of the dried copper substrate by laser, such as figure 1 shown, where the diameter of each concave structure Depth (H) 30μm, row spacing (L) 50μm, column spacing 100μm, laser processing parameters: frequency 20HKz, power 16w, scanning speed 1800mm / s, processing times 2 times;

[0021] Step 4: Place the laser-processed copper substrate in ionized water, acetone, and deionized water for ultrasonic cleaning for 5 minu...

Embodiment 2

[0024] Step 1: Prepare the copper-based material into a size of 20mm×10mm×2mm by wire cutting; then polish the cut copper substrate on 600-mesh, 1000-mesh, 1500-mesh, and 2000-mesh sandpaper to make the surface smooth;

[0025] Step 2: Polish the copper substrate on a polishing machine to make the surface of the substrate smooth; then place the copper substrate in alcohol for ultrasonic cleaning for 5 minutes; dry the cleaned copper substrate briefly, and observe the surface whether it is cleaned;

[0026] Step 3: Using a laser to prepare a concave matrix structure on the surface of the dried copper substrate, wherein the diameter of each concave structure is Depth (H) 10μm, row spacing (L) 100μm, column spacing 50μm, laser processing parameters: frequency 20HKz, power 16w, scanning speed 1800mm / s, processing times 2 times;

[0027] Step 4: Place the laser-processed copper substrate in ionized water, acetone, and deionized water for ultrasonic cleaning for 5 minutes; then dr...

Embodiment 3

[0030] Step 1: Prepare the copper-based material into a size of 20mm×10mm×2mm by wire cutting; then polish the cut copper substrate on 600-mesh, 1000-mesh, 1500-mesh, and 2000-mesh sandpaper to make the surface smooth;

[0031] Step 2: Polish the copper substrate on a polishing machine to make the surface of the substrate smooth; then place the copper substrate in alcohol for ultrasonic cleaning for 5 minutes; dry the cleaned copper substrate briefly, and observe the surface whether it is cleaned;

[0032] Step 3: Using a laser to prepare a concave matrix structure on the surface of the dried copper substrate, wherein the diameter of each concave structure is Depth (H) 30μm, row spacing (L) 50μm, column spacing 50μm, laser processing parameters: frequency 20HKz, power 16w, scanning speed 1800mm / s, processing times 2 times;

[0033] Step 4: Place the laser-processed copper substrate in ionized water, acetone, and deionized water for ultrasonic cleaning for 5 minutes; then dry...

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Abstract

The invention discloses a copper-based material surface icing-delaying structure and a preparation method thereof, and relates to the field of metal material surface icing delay. By changing the structure of the copper-based material surface, the effect of delaying icing is achieved. The icing-delaying structure is characterized in that the surface of a copper matrix with the smooth surface is provided with a concave matrix structure with the diameter of 35-45 microns, the depth of 10-30 microns and the distance of 50-300 microns. The preparation method comprises the following steps that the surface of a copper matrix is ground and pre-ground, the pre-ground copper matrix is placed on a polishing machine for being polished until the surface of the copper matrix is smooth, the concave matrix structure with the diameter of 35-45 microns, the depth of 10-30 microns and the distance of 50-300 microns is prepared on the surface of the polished copper matrix by adopting lasers, and the copper matrix prepared by the lasers is placed in deionized water, acetone and deionized water for ultrasonic cleaning. According to the structure and the preparation method thereof, the surface has good icing delay performance, the working requirements of a copper-based material under complex temperature environments are improved, especially relevant fields with large high and low temperature drop andsubzero temperature, and the purposes of reducing energy consumption, improving the working efficiency, improving the practicability and the like are achieved.

Description

technical field [0001] The invention relates to the field of delayed icing on the surface of metal materials, in particular to a copper-based material surface delayed icing structure and a preparation method thereof. Background technique [0002] In modern industrial production and life, copper-based materials are widely used. Due to its good mechanical properties, low temperature resistance, wear resistance, soft texture and excellent process performance, it has been widely used in various industries, including automobiles, chemical machinery, ships, aviation industry and medical equipment and household appliances. With the development of industrial modernization and social science and technology, copper-based materials are used in more and more various environments, and the working conditions they face are also more complicated. Therefore, people's requirements for the use and process performance of copper-based materials continue to increase, which makes the surface prop...

Claims

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Application Information

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IPC IPC(8): B23P15/00
CPCB23P15/00
Inventor 李晶杜锋黄志新徐成宇张为周轶杰周璎珞程诚
Owner CHANGCHUN UNIV OF SCI & TECH
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