Method for rapidly etching and analyzing chemical state of material interface elements by using X-ray photoelectron spectrometer
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HARBIN INST OF TECH
- Publication Date
- 2019-11-22
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Abstract
Description
technical field
[0001] The invention relates to a method for analyzing the chemical state of material interface elements. Background technique
[0002] With the development of semiconductor materials, the application of semiconductor devices in optoelectronic functions is becoming more and more extensive. For this type of device, it is not only necessary to analyze the surface of the semiconductor material itself, but more importantly, to analyze the chemical state of the elements at the interface between the device and the film layer, so as to effectively judge the application performance of the device (for example: between the device and the film layer). The size of the interface work function barrier and the adhesion characteristics between the layers of the film, etc.). X-ray photoelectron spectroscopy is an effective means to finely detect the state of surface chemical elements. In order to realize the interface analysis between film layers, argon ions can be used for...