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Device and method for removing contaminating particles in vacuum chamber

A technology for contaminating particles and removing devices, which is applied in the directions of cleaning methods, cleaning methods and utensils, chemical instruments and methods using gas flow, etc., can solve the problems of increasing cleaning time, increasing labor consumption, affecting production, etc., and improving production efficiency. and output, reduce labor consumption, improve the effect of running time

Active Publication Date: 2021-04-13
SHANGHAI HUALI INTEGRATED CIRCUTE MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Obviously, opening the cavity to clean the ion beam cavity will greatly increase the cleaning time, increase the downtime of the ion implanter, and finally affect production; at the same time, it will also increase manpower consumption

Method used

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  • Device and method for removing contaminating particles in vacuum chamber

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Embodiment Construction

[0042] Such as figure 1 As shown, it is a schematic structural diagram of a device for removing contaminated particles in a vacuum chamber according to an embodiment of the present invention; the device for removing contaminated particles in a vacuum chamber according to an embodiment of the present invention includes:

[0043] The vacuum chamber 1 is connected with a vacuum pump 3 through a vacuum pipeline 2 .

[0044] In the embodiment of the present invention, the vacuum chamber 1 is an ion beam chamber of an ion implanter. The tube walls of the components of the ion beam cavity are composed of graphite.

[0045] The ion implanter also includes an ion source chamber and a process injection chamber; the first side of the ion beam chamber is connected to the ion source chamber, and the second side of the ion beam chamber is connected to the process implantation chamber. cavity.

[0046] The vacuums of the ion source chamber, the ion beam chamber and the process injection c...

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PUM

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Abstract

The invention discloses a device for removing polluted particles in a vacuum chamber, comprising: a vacuum chamber connected to a vacuum pump through a vacuum pipeline; an isolation valve is arranged on the vacuum pipeline; the first end of the hand valve is connected to the vacuum chamber and connected to the vacuum chamber Internal communication; the second end of the hand valve is connected to the vacuum cleaner; when the vacuum chamber is working, the isolation valve is opened, and the hand valve is closed; The first end communicates with the first end, and the vacuum cleaner is connected to the second end of the hand valve to remove the pollution particles in the vacuum chamber. The invention also discloses a method for removing polluted particles in the vacuum chamber. The invention can remove the polluted particles from the vacuum cavity without opening the cavity, can eliminate the impact of the particles on the product, can improve the running time of the production equipment, improve the production efficiency and reduce the manpower consumption.

Description

technical field [0001] The invention relates to the field of semiconductor integrated circuit manufacturing, in particular to a device for removing polluted particles in a vacuum chamber. The invention also relates to a method for removing polluted particles in a vacuum chamber. Background technique [0002] Ion implanters are widely used in the field of semiconductor manufacturing, and can realize the doping of semiconductor substrates such as silicon substrates. An ion implanter includes an ion source, an ion beam (beam line) path, and a terminal station. The ion source is to generate positive ions through the impact of hot electrons on the dopant gas. After the positive ions are accelerated, they enter the ion beam path, and then enter the terminal after impurity selection, ion acceleration and deceleration, focusing and deflection in the ion beam path. The stage implants ions into the semiconductor substrate. [0003] All ion implanters need to use a vacuum environmen...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B08B5/04H01J37/02H01J37/30
CPCB08B5/04H01J37/026H01J37/3002
Inventor 朱佳源
Owner SHANGHAI HUALI INTEGRATED CIRCUTE MFG CO LTD
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