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Power module

A power module and electrode technology, which is applied in the direction of circuits, electrical components, and electrical solid devices, can solve problems such as increased power loss, damage, and large voltage changes between the gate and source, and achieve the effect of suppressing malfunctions

Active Publication Date: 2019-11-26
ROHM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In a bridge circuit composed of transistors, there is a phenomenon that when the transistor on one arm is turned on at high speed, the voltage between the gate and the source of the transistor on the other side changes due to the change in the voltage between the drain and the source. , resulting in malfunction (false conduction) (for example, refer to Patent Document 1)
Short-circuit current caused by false turn-on not only destroys transistors, but also causes increased power loss and noise
Especially in SiC MOSFET (Metal-Oxide Semiconductor Field Effect Transistor), the ratio of parasitic capacitance Cgs between gate and source to parasitic capacitance Cgd between gate and drain is small, so the voltage between gate and source varies greatly. In addition, The on-resistance is also low, so the short-circuit current caused by false conduction also increases, which easily leads to damage

Method used

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Experimental program
Comparison scheme
Effect test

no. 1 approach

[0059] (basic structure)

[0060] figure 1 (a) shows a schematic planar pattern structure of the basic structure of the power supply module according to the first embodiment, figure 1 (b) shows along figure 1 (a) Schematic cross-sectional structure of the I-I line. The basic configuration of the power supply module according to the first embodiment can be applied to, for example, a 1-in-1 module.

[0061] Such as figure 1 (a) and figure 1 As shown in (b), the power module related to the basic structure of the first embodiment includes: a ceramic substrate 8; electrode patterns 10U, SSP (10U), and MGP (10U) arranged on the ceramic substrate 8; The clamp transistor QM is arranged on the electrode pattern 10U for short-circuiting the gate-source of the target power transistor (not shown), and the electrode pattern 10D is arranged on the back surface of the ceramic substrate 8 .

[0062] Such as figure 1 (a) and figure 1 As shown in (b), the power module according to the f...

no. 2 approach

[0109] (2 in 1 structure)

[0110] Figure 6 A schematic planar pattern structure of the power module 2 according to the second embodiment is shown, Figure 7 show with Figure 6 The circuit structure of the corresponding power module. here, Figure 7 The circuit structure surrounded by a dotted line represents the power supply circuit 1 of the power supply module 2 according to the second embodiment.

[0111] Figure 6 A schematic planar pattern structure before forming the resin layer 120 in the power supply module 2 according to the second embodiment, that is, a module with a built-in half-bridge circuit is shown, Figure 26 (b) shows a schematic bird's-eye view structure after forming the resin layer 120 . here, Figure 7 The circuit structure surrounded by a dotted line represents the power supply circuit 1 of the power supply module 2 according to the second embodiment. The following are the same. The power module 2 according to the second embodiment has a struc...

no. 3 approach

[0130] Figure 8 A schematic planar pattern structure of the power module 2 according to the third embodiment is shown, Figure 9 Show its circuit structure. here, Figure 9 The circuit structure surrounded by a dotted line represents the power supply circuit 1 of the power supply module 2 according to the third embodiment.

[0131] Such as Figure 8 As shown, the power module 2 according to the third embodiment includes a DC link capacitor C electrically connected between the positive power terminal P and the negative power terminal N. PN . as DC link capacitor C PN , can apply ceramic capacitors, etc.

[0132] Such as Figure 8 and Figure 9 As shown, the power module 2 according to the third embodiment includes: a positive power terminal P and a negative power terminal N; a drain pattern D1 connected to the positive power terminal P; a source pattern S4; and a DC link capacitor C disposed between the drain pattern D1 and the source pattern S4 PN . exist Figure 8 ...

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PUM

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Abstract

This power module (2) includes at least one half bridge (1), and comprises, respectively in the upper and lower arms thereof: first transistors Q1, Q4; second transistors QM1, QM4, the drain of each of which being connected to the gate G1, G4 side of the respective first transistors, the source of each of which being connected to the source S1, S4 side; source signal wiring patterns SSP1, SSP4 connected to the source of the respective first transistors; first connection conductors MSW1, MSW4 connecting the respective source signal wiring patterns and the source of the respective second transistors; second gate signal wiring patterns MGP1, MGP4 connected to the gate MG1, MG4 of the respective second transistors; and second connection conductors MGW1, MGW4 connecting the respective second gate signal wiring patterns and the gate of the respective second transistors. The length of each first connection conductor is shorter than or equal to the length of each second connection conductor. Thus, a power module having a high-speed switching performance and in which malfunctions are suppressed is provided.

Description

technical field [0001] The invention relates to a power supply module. Background technique [0002] Currently, many research institutions are conducting research and development of silicon carbide (SiC: Silicon Carbide) devices. Features of SiC power devices include low on-resistance, high-speed switching, and high-temperature operation, which are superior to conventional Si power devices. [0003] Circuits including bridge circuits are widely used in switching power supplies, inverters for driving motors, and the like. In a bridge circuit composed of transistors, there is a phenomenon that when the transistor on one arm is turned on at high speed, the voltage between the gate and the source of the transistor on the other side changes due to the change in the voltage between the drain and the source. , resulting in malfunction (false conduction) (for example, refer to Patent Document 1). The short-circuit current caused by false conduction not only destroys the transisto...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/07H01L23/48H01L25/18H02M7/48
CPCH01L23/48H01L2224/0603H01L2224/40225H01L2224/48091H01L2224/48227H01L2224/49113H02P27/06H01L2224/40227H01L2224/41052H01L2224/49052H01L24/48H01L24/40H01L2924/19105H01L2924/19107H01L25/072H02M7/003H02M1/08H02M7/53875H01L2224/84801H01L24/84Y02B70/10H01L2924/00014H01L2224/73221H01L24/41H01L24/49H01L2224/4103H01L2224/41174H01L2224/48225H01L2224/4903H01L2924/10253H01L2924/10272H01L2924/1033H01L2924/13055H01L2924/13091H02M7/5387
Inventor 宫崎达也大岳浩隆
Owner ROHM CO LTD