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Finite element simulation method for tin-based binary eutectic phase separation

A binary eutectic, analog method technology, applied in instrumentation, calculation, electrical digital data processing and other directions, can solve problems such as time-consuming and difficult, and achieve the effect of solving limitations

Active Publication Date: 2019-11-29
GUILIN UNIV OF ELECTRONIC TECH
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Problems solved by technology

[0005] It is very difficult and time-consuming to reveal the separation process of microstructure and the interaction mechanism between electromigration through some traditional experimental methods. So far, there is no effective experimental verification to evaluate and analyze the relationship between electromigration and microstructure. Interaction

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  • Finite element simulation method for tin-based binary eutectic phase separation

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Embodiment 1

[0080] Such as figure 1 As shown, this embodiment provides a finite element simulation method for tin-based binary eutectic phase separation, which specifically includes the following steps:

[0081] S1: Convert the Potts model to obtain a 0-1 binary matrix representing two phases, and generate a black and white binary image accordingly. The Sn-Bi microstructure model obtained by the Monte Carlo Potts method consists of 400×400 (R=400 rows, C=400 columns) sites, and each site in the array represents a domain with a specific lattice orientation . The sites are designated by random values ​​between 1 to Q and -Q to -1 (Q=10), which represent spin values, indicating the orientation of the grains. The Bi phase is assigned a positive spin (ie, a site value of 1 to 10), and the Sn phase is assigned a negative spin (ie, a site value of -10 to -1). The Potts model of Sn-Bi microstructure is as follows figure 2 As shown, the Potts model is scanned through the conditional judgment,...

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Abstract

The invention discloses a finite element simulation method for tin-based binary eutectic phase separation, and relates to the technical field of finite element simulation analysis. The method comprises the steps of generating a black-white binary image of a tin-based binary eutectic phase through model processing, defining black-white boundary points of two phases, determining migration directionsof the black-white boundary points of the two phases, simulating a two-phase separation process, outputting a finite element model, and carrying out solution analysis. According to the method, the separation process of two phases in the eutectic structure of the tin-based binary brazing filler metal is simulated; a result in the separation process is output to finite element software; a corresponding finite element model is established; an analysis result of the finite element model is solved; and then, through analysis results, the limitation of related research on the electromigration problem can be effectively solved, so that the segregation process of the microstructure in the brazing filler metal is effectively represented, and further, the understanding of the interaction mechanismbetween electromigration and segregation of the microstructure in brazing filler metal interconnection can be deepened through finite element simulation results.

Description

technical field [0001] The invention relates to the technical field of finite element simulation analysis, in particular to a finite element simulation method for tin-based binary eutectic phase separation. Background technique [0002] Soldered interconnects (solder joints) have been widely used for physical, mechanical and electrical connections in microelectronics and systems. With the rapid reduction of the feature size of interconnect solder joints and the high current density of solder joints, electromigration effects have become the focus of attention. Electromigration generally describes the migration of metal ions under the action of an electric field. When an electronic device is operating, a certain amount of current flows within the metal interconnect such that the metal ions will transport mass along the conductor, which will cause whiskers or voids in certain parts (hillocks) of the conductor. However, electromigration is a metal migration phenomenon caused b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCY02E60/00
Inventor 秦红波文泉璋郭磊刘天寒邝田锋梁正超李祎康
Owner GUILIN UNIV OF ELECTRONIC TECH
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