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Curable resin composition, dry film, cured product, electronic component, and printed-wiring board

A curable resin, printed circuit board technology, used in the fields of curable resin compositions, dry films, cured products and electronic components

Active Publication Date: 2019-11-29
TAIYO INK MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, non-patent literature 2 shows that as the frequency increases, the current can only pass near the surface of the conductor

Method used

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  • Curable resin composition, dry film, cured product, electronic component, and printed-wiring board
  • Curable resin composition, dry film, cured product, electronic component, and printed-wiring board
  • Curable resin composition, dry film, cured product, electronic component, and printed-wiring board

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0115] The curable resin composition according to the first embodiment of the present invention is most characterized in that fine powder and a filler other than fine powder are used in combination as fillers.

[0116] With such a configuration, regarding the first object, it is possible to provide a cured product that maintains a low coefficient of thermal expansion even in a temperature range exceeding 200° C. during component mounting and is excellent in various properties such as toughness.

[0117] [fine powder]

[0118] The fine powder used in the present invention refers to a powder with at least one dimension less than 100nm, and as mentioned above, includes not only fine nearly spherical powder, but also fibrous powder with a cross-sectional diameter of less than 100nm and a thickness of less than 100nm. flake (scale-like) powder, etc. Such a fine powder has a much larger surface area per unit mass and a larger ratio of atoms exposed on the surface than a case where ...

no. 2 approach

[0348] The curable resin composition according to the second aspect of the present invention is characterized by comprising: (A) a fine powder having at least one dimension of less than 100 nm; and (B) a thermosetting component.

[0349] According to the characteristic configuration of the second embodiment of the present invention, it is possible to exhibit the characteristic effect of the present invention that, in the printed circuit board having at least one of the concave portion and the through hole, even during high-temperature heating during component mounting Resin filler-filled via holes, recesses such as via holes, conductor pads on via holes, and wiring such as via holes do not swell.

[0350] The detailed mechanism of the expansion of the wiring during this high-temperature heating is not clear, but it is considered that the cause is a large difference in thermal expansion coefficient between the via hole formed of copper and the via hole and the resin filler at hi...

Embodiment

[0407] Hereinafter, the present invention will be described in more detail using examples.

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Abstract

The present invention provides a curable resin composition with which it is possible to obtain a cured product that is capable of retaining a low thermal expansion rate even in a high-temperature range during component mounting and that exhibits various excellent properties such as toughness; and a dry film, a cured product, and an electronic component using the curable resin composition. The curable resin composition comprises a curable resin, a fine powder in which at least one of the dimensions is smaller than 100 nm, and a filler other than the fine powder. The dry film, the cured productand the electronic component are obtained by using said curable resin composition.

Description

technical field [0001] The present invention relates to a curable resin composition, a dry film, a cured product, and an electronic component. Moreover, this invention relates to curable resin composition, hardened|cured material, and a printed wiring board. Background technique [0002] As electronic components, there are wiring boards, active components fixed to the wiring board, passive components, and the like. Among the wiring boards, there are those that connect and fix active components, passive components, etc. by applying conductor wiring to the insulating base material. Depending on the application, the insulating layer and the conductive layer may be multi-layered, or a flexible substrate may be used. Insulating substrates become important electronic components in electronic equipment. In addition, wiring boards are also used in semiconductor packages, and curable resin compositions and dry films for wiring boards are used as outer layers after wiring boards or ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08G59/20C08J5/18C08J7/04C08K7/00H05K3/28C08J7/043
CPCC08G59/20C08J5/18C08J7/04C08K7/00C08L63/00H05K3/28C08L1/02C08K7/16C08L61/06C08J7/0427C08K2201/005
Inventor 大川夏芽增田俊明张振兴宇敷滋三轮崇夫松野匠
Owner TAIYO INK MFG
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