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Manufacturing method of small piece of battery

A battery and silicon wafer technology, applied in circuits, photovoltaic power generation, electrical components, etc., can solve the problems of small cell open-circuit voltage and short-circuit current loss, increase dicing and splitting equipment/steps, and small cell power loss, etc. Adverse effects, avoid secondary consumption, reduce the effect of electrical performance non-uniformity problem

Inactive Publication Date: 2019-12-03
CHANGZHOU SHICHUANG ENERGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The squaring of monocrystalline silicon ingots will produce side skins, and the side skins are generally returned to the furnace or used as high-efficiency polycrystalline ingot seed crystals, etc., resulting in a low utilization rate of monocrystalline silicon rods
[0003] In addition, the existing half-cell, shingled, and patchwork technologies all use small-piece batteries, and the existing small-piece batteries are all cut from finished battery pieces (square or quasi-square), and additional scribing and splitting are required equipment / steps, which increases production cost
[0004] And scribing and splitting the finished battery sheet. After the splitting is completed, a damaged layer will be formed on the edge of the small battery (that is, the break of the whole sheet). The damaged layer has very high surface defects, and the surface defects will become the carrier recombination center. As a result, the minority carrier lifetime in the edge area of ​​the small battery decreases, and the surface recombination current increases significantly, which in turn leads to the loss of the open circuit voltage and short circuit current of the small battery, that is, the power loss of the small battery

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] The specific implementation of the present invention will be further described below in conjunction with the examples. The following examples are only used to illustrate the technical solution of the present invention more clearly, but not to limit the protection scope of the present invention.

[0031] A method for preparing a small-chip battery. Firstly, the edge leather is cut into strip-shaped silicon chips, and then the strip-shaped silicon chips are made into small-chip batteries;

[0032] The edge leather is the edge leather produced by squaring the monocrystalline silicon rod; the edge leather respectively includes: a rectangular cutting surface formed by squaring, and an arc surface opposite to the cutting surface; the cutting surface is used as the reference plane; The junction of the cutting surface and the arc surface is a sharp corner;

[0033] Said cutting the silicon rod edge leather into strip silicon chips comprises the following steps:

[0034] Cut o...

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PUM

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Abstract

The invention discloses a manufacturing method of a small piece of battery. A silicon rod edge leather material is cut into small pieces of silicon wafers, and then production of battery pieces is completed through a matched battery production line so that the small piece of batteries required by half-piece, imbrication, splicing and other assembly technologies can be directly obtained. Compared with an existing edge leather material melting mode, by using the method of the invention, the edge leather material can be used more effectively, energy waste is reduced, and manufacturing cost of thesilicon wafers is greatly saved. In the invention, the silicon rod edge leather material is directly cut into the small silicon wafers so that damage layers on edges of the small silicon wafers can be removed in a manufacturing process of the battery pieces, an adverse effect of the edge damage layers is eliminated, and power losses of the small pieces of batteries caused by segmentation of finished battery pieces are avoided.

Description

technical field [0001] The invention relates to a method for preparing a small battery. Background technique [0002] Monocrystalline silicon wafers are cut from single crystal silicon rods. Generally, the single crystal silicon rods are first cut into squares to obtain square rods for preparing single crystal silicon wafers, and then the square rods are sliced ​​to obtain single crystal silicon wafers. The squaring of monocrystalline silicon ingots will produce side skins, and the side skins are generally returned to the furnace or used as high-efficiency polycrystalline ingot seed crystals, etc., resulting in a low utilization rate of monocrystalline silicon rods. [0003] In addition, the existing half-cell, shingled, and patchwork technologies all use small-piece batteries, and the existing small-piece batteries are all cut from finished battery pieces (square or quasi-square), and additional scribing and splitting are required The equipment / steps increase the productio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/18H01L31/04H01L21/304H01L21/02
CPCH01L21/02005H01L21/304H01L31/04H01L31/1804H01L31/1876Y02E10/50Y02P70/50
Inventor 符黎明曹育红孟祥熙
Owner CHANGZHOU SHICHUANG ENERGY CO LTD
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