Copper colloidal catalyst liquid for electroless copper plating, electroless copper plating method, and production method for copper-plated substrate

Abstract

According to the present invention, the temporal stability and the sustainability of catalyst activity of a catalyst liquid are both significantly improved since electroless copper plating is performed by subjecting a non-conductive substrate to an adsorption acceleration treatment (pretreatment) by bringing the non-conductive substrate into contact with a surfactant-containing liquid, and by applying a catalyst to the non-conductive substrate using a copper colloidal catalyst liquid that is for electroless copper plating and that contains (A) a soluble copper salt, (B) a reducing agent, (C) acolloidal stabilizer, and (D) a non-reducing oligosaccharide such as sucrose and trehalose. In addition, a deposited copper coating membrane will have excellent appearance since electroless copper plating is performed by applying a catalyst after the catalyst activity thereof is enhanced by the adsorption acceleration treatment (pretreatment).

Description

technical field [0001] The present invention relates to a copper colloidal catalyst solution for providing a catalyst as a pretreatment when performing electroless copper plating on a non-conductive substrate, an electroless copper plating method using the catalyst solution, and a copper-plated substrate using the method to form a copper film Manufacturing method. The present invention also relates to a copper colloidal catalyst solution that has significantly improved stability over time and sustained catalyst activity, and can impart an excellent appearance to the copper film. Background technique [0002] For glass-epoxy resin, glass-polyimide resin, epoxy resin, polyimide resin, polycarbonate resin, ABS resin, PET resin and other resin substrates such as glass substrates, ceramic substrates, etc. To implement electroless copper plating on a conductive substrate, the usual method is: firstly, precious metals such as palladium, silver, and platinum are adsorbed on the sub...

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Problems solved by technology

[0016] The basic principle of the above-mentioned catalyst solution is to treat a soluble metal salt with a reducing agent to generate metal fine particles, but in fact, including the catalyst solutions of the above-mentioned Patent Documents 1 to 5, the catalyst solution based on this principle is usually particularly stable over time. There is a problem, it is not easy to maintain the continuity of catalyst imparting operation and electroless plating operation smoothly for a long time

[0017] If the stability over time is reduced, even if the catalyst is applied and electroless copper plating is performed, there will be defects in the coating film such as poor film deposition or partial non-deposition of the film, resulting in unevenness of the coating film and poor uniformity.

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