Conductive connections, process chambers and semiconductor processing equipment

Abstract

The invention discloses a conductive connector, a process chamber and semiconductor processing equipment. It includes: a first installation part; a second installation part, which is arranged at a distance from the first installation part; a bending connection part, which bends and extends from the end of the first installation part and connects with the second installation part connection; and, the bending connection part can be stretched vertically between the first installation part and the second installation part. When assembling the process component into the process chamber, first maintain the close contact between the mounting part and the dielectric window in the vertical direction to achieve vacuum sealing, and then keep the first mounting part in close contact with the mounting part, so that the second mounting part During the process of being in close contact with the grounding part, the bent connection part can be stretched and deformed in the vertical direction, realizing the close contact between the second mounting part and the grounding part, thereby fulfilling the dual requirements of vacuum sealing and good grounding.

Description

technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to a conductive connector, a process chamber including the conductive connector, and semiconductor processing equipment. Background technique [0002] Physical vapor deposition, also known as sputtering, is one of the most commonly used processes in the manufacture of electronic components. It is mainly a process in which energetic particles (such as argon ions) bombard a solid surface, causing various particles on the surface, such as atoms, molecules or clusters, to escape from the surface of the object and then deposit on the surface of the wafer to form a thin film. [0003] Generally, the process chamber of physical vapor deposition equipment includes grounded process components to ground the process chamber as a loop for the radio frequency energy that generates the plasma. If the grounding is not good, it will lead to abnormal plasma generated inside the proce...

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Problems solved by technology

[0005] However, if figure 1 As shown, the mounting part 211 needs to be well grounded with the grounding part 212 as the contact surface, and at the same time, the mounting part 211 is also used as the sealing surface of the dielectric window 220 to ensure vacuum sealing, which requires that the height of each part of the process assembly 210 be limited to an extreme Within the small tolerance range, it will undoubtedly increase the difficulty of processing and assembly, and at the same time increase the risk of vacuum leakage in the process chamber 200 and poor grounding of the process component 210, thereby increasing the uncertainty of the process

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