A method of laser modulation of inner surface features of high aspect ratio holes

A technology with a high depth-to-diameter ratio on the inner surface of the hole, applied in laser welding equipment, manufacturing tools, metal processing equipment, etc., can solve problems such as fatigue cracks and reduce the overall life of workpieces such as crankshafts, improve wetting performance, and eliminate surface microscopic Effect of cracking and efficiency improvement

Active Publication Date: 2021-10-12
SHANDONG UNIV OF TECH
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Problems solved by technology

Under the action of alternating loads, fatigue cracks will occur, which greatly reduces the overall life of workpieces such as crankshafts

Method used

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  • A method of laser modulation of inner surface features of high aspect ratio holes
  • A method of laser modulation of inner surface features of high aspect ratio holes

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Experimental program
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Embodiment 1

[0027] Refer to attached figure 1 :

[0028] A method for modulating the inner surface characteristics of a hole with a high depth-to-diameter ratio by using a laser, comprising the following steps:

[0029] (1) Clean the inner surface of the hole to remove impurities; the angle between the axis of the hole and the outer surface is a vertical angle or an inclined angle. The hole material can be steel material, metal material, semiconductor material or ceramic material.

[0030] (2) Clamp the workpiece so that the axis of the hole coincides with the normal incidence direction of the laser; the laser can be continuous laser or pulsed laser. The laser energy melts on the surface of the hole or the surface temperature increases by more than 300°C.

[0031] (3) Adjust the laser parameters, deflect the laser incident angle, and periodically scan along the inner surface of the hole; the laser energy is set above the melting threshold or below the melting threshold. The laser ener...

Embodiment 2

[0037] Refer to attached figure 2 :

[0038] Processing system with vibrating mirrors: In this embodiment, a vibrating mirror 11 , an f-θ mirror 12 , a workpiece 13 and a reflecting mirror 14 are arranged on the translation stage 9 .

[0039] as attached figure 2 As shown, the sample of the test piece is prepared first. The material of the sample is 42CrMo, and a through hole with a diameter of 6mm is opened. Use acetone, ethanol, and water to ultrasonically clean each for 3 minutes to make the surface free of particles and other pollution. Use a special fixture to make the hole axis vertically upward, and install it on the displacement table 9. Adjust the parameters of laser 1 so that the energy focused on the hole wall will cause the temperature of the hole surface to rise above 300°C or melt a thin layer. By controlling the vibrating mirror 11 and the displacement table 9, the beam is rotated and moved up and down, so that the beam rotates around the inner surface of ...

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Abstract

The invention relates to a method for modulating inner surface features of a hole with a high depth-to-diameter ratio by using a laser, belonging to the technical field of laser processing. It is characterized in that it includes the following steps: (1) cleaning the inner surface of the hole; (2) clamping so that the axis of the hole coincides with the normal incident direction of the laser; (3) deflecting the incident angle of the laser and periodically scanning along the inner surface of the hole; (4) Adjust the distance of the beam relative to the surface of the workpiece; (5) Make the beam cover the entire inner surface of the hole. The invention is based on laser remelting technology, and adopts laser to reprocess holes with high depth-to-diameter ratio. Efficiently eliminate local lines and local microcracks by laser melting a thin layer of material. Greatly reduces surface roughness and eliminates surface microcracks. It has the characteristics of high precision and high efficiency, and can realize assembly line production.

Description

technical field [0001] The invention relates to a method for modulating inner surface features of a hole with a high depth-to-diameter ratio by using a laser, belonging to the technical field of laser processing. Background technique [0002] The processing of deep holes with high depth-to-diameter ratio has always been a difficult and key process in machining, and is the bottleneck process of the production line. The refined processing with high depth-to-diameter ratio and small aperture poses a severe test to traditional machining. Slender holes are usually obtained by drilling, and the inner wall has processing lines and microscopic cracks. Under the action of alternating loads, fatigue cracks will occur, which greatly reduces the overall life of workpieces such as crankshafts. Contents of the invention [0003] The technical problem to be solved by the present invention is: to overcome the deficiencies of the prior art, to provide a laser remelting technology, which ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/352B23K26/354
CPCB23K26/352B23K26/354
Inventor 王志文郑宏宇丛建臣
Owner SHANDONG UNIV OF TECH
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