PCB silver electroplating solution containing compound sulfonate brightening agent

A PCB board, sulfonate technology, applied in electrical components, printed circuits, printed circuit manufacturing and other directions, can solve the problems of high solder joint strength, easy decomposition, good soldering performance, etc., and achieve the effect of improving surface gloss.

Active Publication Date: 2019-12-20
FOSHAN RENCHANG TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

② Good welding performance, high solder joint strength, fast welding speed, good solder joint brightness, compared with cyanide silver plating, the effect is the same, but the tin wettability is slightly worse
[0009] However, the above-mentioned silver plating system is complicated, and there are usually other organic systems besides the brightener, which makes the plating solution unstable and easy to decompose.

Method used

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  • PCB silver electroplating solution containing compound sulfonate brightening agent

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] 1. Configure plating solution:

[0033] (1) Dissolve 45g of silver nitrate in deionized water,

[0034] (2) Dissolve 150g potassium thiosulfate and 55g potassium metabisulfite in deionized water in another container and stir;

[0035] (3) Compound sulfonate brightener, benzothiazolyl-S-(CH 2 ) 3 -SO 3 Na: (CH3) 2 -N-C(=S)-S-(CH 2 ) 3 -SO 3 Na=3:1, total 400ppm, and dissolved in deionized water;

[0036] (4) Mix the brightener solution of step 3 with the solution of step 2;

[0037] (5) Add the solution obtained in step 4 to step 1 under ultrasonic enhancement;

[0038] (6) Add the remaining amount of deionized water to a constant volume according to the aforementioned formula concentration, and add sodium hydroxide to adjust the pH to 9.5-10.5, and let it stand for use.

[0039] 2. Plating process:

[0040] After degreasing and cleaning the PCB board, put it into the plating solution, the current density is 10A / dm 2 . , The plating time is 25MIN.

Embodiment 2-3

[0041] In Example 2-3, see Table 1 for specific parameters. Other processes are the same as in Example 1.

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PUM

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Abstract

The invention relates to a PCB silver electroplating solution containing a compound sulfonate brightening agent. The PCB silver electroplating solution includes 45 g / L to 55 g / L of silver nitrate, 150g / L-240 g / L of potassium thiosulfate and 55 g / L to 80 g / L of potassium metabisulfite. The compound sulfonate brightening agent is divided into a component A and a component B, wherein the component Ais sodium sulfonate containing benzothiazole end groups, and the component B is sulfonate containing -N-C(=S)-S-groups. By means of the PCB silver electroplating solution containing the compound sulfonate brightening agent, the brightening agent combination with the specific groups is creatively adopted, the surface gloss is obviously improved, and the brightening agent combination is matched with applicability of cyanide-free system silver plating in a circuit board.

Description

Technical field [0001] The invention relates to a printed circuit board (PCB), in particular to a PCB board silver electroplating solution containing a compound sulfonate brightener. Background technique [0002] With the development of communication technology and the development of the new generation of communication technology, the demand for printed circuit boards is increasingly demanding. Although the traditional copper-based electroplating printed circuit board pattern has not been broken, it is Some high-precision modules with special needs require higher conductivity and stability. Therefore, PCB silver plating still needs room for improvement. However, due to the active pursuit of low-cost copper for many years, the silver luster is Electroplating can no longer be stably provided in the PCB industry. [0003] Chinese invention patent CN105063700A discloses a low-cost, simple and controllable process for electroplating silver on the surface of a printed circuit board with...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/46C25D7/00H05K3/18
CPCC25D3/46C25D7/00H05K3/188
Inventor 李爱芝
Owner FOSHAN RENCHANG TECH
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