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Power supply impedance test method and circuit board

A technology of impedance test and test method, applied in the field of power supply impedance test method and circuit board, can solve the problem of limited current-carrying capacity of PCB, and achieve the effect of improving test accuracy, high precision and reducing influence

Pending Publication Date: 2019-12-20
上海泽丰半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a power supply impedance testing method and a circuit board to solve the technical problem of limited current-carrying capacity of the existing PCB

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  • Power supply impedance test method and circuit board
  • Power supply impedance test method and circuit board
  • Power supply impedance test method and circuit board

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Embodiment Construction

[0033] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the specific implementation manners of the present invention will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention, and those skilled in the art can obtain other accompanying drawings based on these drawings and obtain other implementations.

[0034] In order to make the drawing concise, the parts related to the present invention are only schematically shown in each drawing, and they do not represent the actual structure of the product. In addition, to make the drawings concise and easy to understand, in some drawings, only one of the components having the same structure or function is schematically shown, or only one of them is marked. Herein, "a" not only means "only one", but also means "more than one".

[0035] In ...

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Abstract

The invention discloses a power supply impedance test method and a circuit board. The power supply impedance test method comprises the steps of: connecting a connector used for impedance testing to apreset matching interface on the circuit board; electrically connecting pin ends of to-be-tested power supplies with one another to form impedance test regions in a BGA region of the circuit board, and electrically connecting the matching interfaces which are arranged at the edges of the impedance test regions with the pin ends; setting a test condition, and testing impedance of the to-be-tested power supplies by adopting an AC impedance testing method. According to the power supply impedance test method and circuit board, test points are closer to a chip when the circuit board undergoes powersupply impedance measurement, and the difference in test positions is very small; capacitors of the to-be-tested power supplies do not need to be removed during testing, and the performance of the power supplies is reserved; and the test data precision is very high, and the power supply performance is well fed back.

Description

technical field [0001] The invention relates to the technical field of power supply testing, in particular to a power supply impedance testing method and a circuit board. Background technique [0002] With the rapid development of the communication industry, the requirements for big data computing capabilities are getting higher and higher, and the requirements for the measurement accuracy of on-board power supply performance are also getting higher and higher. The measurement of power supply performance is mainly divided into two types: one is the measurement based on ripple noise, which uses an oscilloscope to capture the power supply ripple, which belongs to time domain measurement; the other is based on the measurement of power supply impedance , which captures the AC (alternating current) impedance of the power supply through the network analyzer, which belongs to the frequency domain measurement. [0003] At present, the AC impedance measurement of the power supply ge...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/40G01R27/02
CPCG01R31/40G01R27/02
Inventor 梁建罗雄科
Owner 上海泽丰半导体科技有限公司