A kind of preparation method of double-sided microstructure polyimide film optical device

Abstract

The invention discloses a preparation method of a double-sided microstructure polyimide thin film optical device, which solves the problems of high production cost and difficult realization of the working environment in the existing polyimide processing method. The preparation method of the present invention specifically includes the following steps: (1) coating the polyimide precursor solution on the surface of the substrate mold, and baking at a low temperature to a gel state; (2) overprinting and embossing on the surface of the polyimide gel Imprinting the mold, and embossing and raising the temperature to semi-cure the polyimide gel; (3) peeling off the embossing mold to obtain a semi-solid polyimide structure, and baking until it is completely imidized; (4) The substrate mold was peeled off to obtain a double-sided microstructured polyimide film optical device. The present invention can simultaneously obtain micro-nano structures on both sides of the polyimide film by means of gluing, embossing and gradient heating methods. The method is simple and fast, has strong universal applicability, high preparation process efficiency and low cost, and can be used to prepare composite functional films optical instrument.

Description

technical field [0001] The invention belongs to the field of thin film optical device manufacturing, and in particular relates to a method for preparing a double-sided microstructure polyimide thin film optical device. Background technique [0002] Polyimide (PI) is widely used in aviation, aerospace, microelectronics, laser and other fields due to its excellent physical, chemical, electrical and mechanical properties. Since the MOIRE project in the United States proposed the use of polyimide thin film optics for space telescopes in 2010, research on PI thin film optics has become increasingly popular. With the different application requirements of PI thin film optical devices in different occasions, higher requirements are put forward for their device performance. For example, in the application of thin-film diffractive lenses, PI films must not only have precise diffractive structures, but also have good light transmission. By simultaneously processing sub-wavelength ant...

AI Technical Summary

Problems solved by technology

[0003] There are three commonly used processing methods for polyimide: nanoimprinting, laser ablation and photolithography. Due to the stable physical properties of PI, nanoimprinting needs to work at a super glass transition temperature (300°C), which is often difficult to achieve; and Photolithography and laser ablation are difficult to process sub-wavelength structures, and the production cost is high

It is difficult to process high-precision micro-nano structures on both sides of the PI film at the same time in the existing technology

Images