Special plastic plate capable of improving diamond wire cutting large system and preparation method thereof

A technology of diamond wire cutting and plastic plate, which is applied in the field of plastic plate preparation, can solve the problems of affecting the cutting process, the conductivity, the large fluctuation range of pH value, and the inability to maintain the stability of the large circulation system, so as to save energy consumption and improve the tensile strength. Good, easy to recycle effect

Active Publication Date: 2019-12-27
广西拓源新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a special plastic plate capable of improving the diamond wire cutting large system and its preparation method to solve the problem that the general plastic plate cannot maintain

Method used

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  • Special plastic plate capable of improving diamond wire cutting large system and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Example Embodiment

[0025] implementation plan:

[0026] 1. Experimental equipment

[0027] Mixer (with adjustable speed stirring device), twin-screw extrusion granulator (with automatic temperature control device, cooling device, vacuum device), dryer (with adjustable speed stirring device, automatic Temperature control device, cooling device), single screw extrusion molding machine (with automatic temperature control device, cooling device, vacuum device).

[0028] 2. Preparation before the experiment

[0029] Clean the mixer, twin-screw extrusion granulation, dryer, and single-screw extruder to ensure that there are no other materials or impurities that affect the reaction.

[0030] 3. The preparation formula of the special plastic board that can improve the diamond wire cutting system: take the mass percentage as the unit, including

[0031] ABS resin 65%-90%, PMMA resin 5%-30%, compatibilizer 1%-10%, EAA resin 1%-10%, scale inhibitor 0.6%-1.5%, antioxidant 0.2%-1% , Lubricant 0.3%-2%, surface active ...

Example Embodiment

[0043] Example 1

[0044] 1. Experimental equipment

[0045] Mixer (with adjustable speed stirring device), twin-screw extrusion granulator (with automatic temperature control device, cooling device, vacuum device), dryer (with adjustable speed stirring device, automatic Temperature control device, cooling device), single screw extrusion molding machine (with automatic temperature control device, cooling device, vacuum device).

[0046] 2. Preparation before the experiment

[0047] Clean the mixer, twin-screw extrusion granulation, dryer, and single-screw extruder to ensure that there are no other materials or impurities that affect the reaction.

[0048] 3. The preparation formula of the special plastic board that can improve the diamond wire cutting system: in mass percentage, including ABS resin 70.3%, PMMA resin 20%, compatibilizer 2.6%, EAA resin 4.2%, scale inhibitor 0.8 %, antioxidant 0.7%, lubricant 1%, surface active agent 0.4%;

[0049] The compatibilizer is SMA resin;

[0050...

Example Embodiment

[0058] Example 2

[0059] 1. Experimental equipment

[0060] Mixer (with adjustable speed stirring device), twin-screw extrusion granulator (with automatic temperature control device, cooling device, vacuum device), dryer (with adjustable speed stirring device, automatic Temperature control device, cooling device), single screw extrusion molding machine (with automatic temperature control device, cooling device, vacuum device).

[0061] 2. Preparation before the experiment

[0062] Clean the mixer, twin-screw extrusion granulation, dryer, and single-screw extruder to ensure that there are no other materials or impurities that affect the reaction.

[0063] 3. The preparation formula of the special plastic board that can improve the diamond wire cutting system: In terms of mass percentage, it includes 76.4% ABS resin, 15% PMMA resin, 3% compatibilizer, 3% EAA resin, and 1% scale inhibitor. , Antioxidant 0.5%, lubricant 0.8%, surface active agent 0.3%;

[0064] The compatibilizer is SMA r...

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Abstract

The invention discloses a special plastic plate capable of improving a diamond wire cutting large system and a preparation method of the special plastic plate. The invention belongs to the technical field of production of plastic plates. The special plastic plate includes, by mass, 65%-90% of ABS resin, 5%-30% of PMMA resin, 1%-10% of a compatilizer, 1%-10% of EAA resin, 0.6%-1.5% of a scale inhibitor, 0.2%-1% of an antioxidant, 0.3%-2% of a lubricant and 0.1%-1% of a surfactant. The special plastic plate is prepared through the steps of raw material mixing, granulation, extrusion molding, polishing, cutting, detection, packaging and the like. The special plastic plate provided by the invention can effectively adjust the pH and conductivity of a large circulation system, has the characteristic of convenience in recycling of silicon materials and ABS/PMMA plastic plates, and can bring obvious benefits of saving energy consumption, reducing cost and improving production efficiency.

Description

technical field [0001] The invention belongs to the technical field of plastic plate preparation, and in particular relates to a special plastic plate capable of improving large diamond wire cutting systems and a preparation method thereof. Background technique [0002] During the cutting process of solar silicon wafers, the backing plate, as an indispensable cutting auxiliary material, plays an important role in diamond wire cutting silicon wafers. [0003] Most of the backing plates used in traditional diamond wire silicon wafer cutting are epoxy, phenolic and polyester, and the specific gravity is heavy during use, at 1.5-2.0g / cm 3 , prone to problems such as breakage, broken wires, blocked filter bags, sticky wires, and inconvenient recycling of silicon materials and backing plates, and then gradually replaced by plastic plates, but also accompanied by new problems. General plastic plates cannot maintain The large circulation system is stable, and the conductivity and p...

Claims

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Application Information

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IPC IPC(8): C08L55/02C08L33/12C08L35/06C08L23/08C08K5/526C08K5/20C08K5/5435C08K5/5317C08K5/00
CPCC08L55/02C08K2201/014C08L2205/035C08L33/12C08L35/06C08L23/0869C08K5/526C08K5/20C08K5/5435C08K5/5317C08K5/00
Inventor 梁羽潘永强苏光临陈韬
Owner 广西拓源新材料有限公司
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