A method for binding planar small-size sputtering targets used in testing machines

Abstract

The invention relates to a method for binding a plane small-size sputtering target used in a testing machine, comprising the following steps: Step 1: Pretreatment of the copper back plate and the target blank: respectively binding the copper back plate and the target blank Sandblasting; Step 2: Preparation of high-temperature adhesive: Stir the two-component silicone elastomer; Step 3: Binding treatment: Select the binding layer, and evenly coat the prepared high-temperature adhesive on the copper backplane and the target embryo Lay the binding layer on the copper backboard that has been coated with high-temperature glue; put the glue-coated side of the target blank down so that the target blank and the copper backplane are completely bonded; solidify the high-temperature glue, That is, the target binding operation is completed. The invention avoids the high-temperature operation of the binding process and reduces labor intensity; binding under low temperature conditions avoids the deformation of the copper back plate and meets the flatness requirements of the target material; the high-temperature glue failure temperature of the binding material is high, which meets the binding requirements of the target material on the high melting point Requirements for fixed layers; simple operation, high efficiency and low cost compared with ordinary binding technology.

Description

technical field [0001] The invention relates to the technical field of target binding, in particular to a binding method for a planar small-size sputtering target used in a testing machine. Background technique [0002] There are many coating machines in research institutes, universities or coating manufacturers' laboratories to conduct research on various film systems. Considering factors such as cost and operation, the structure of this test coating machine is usually relatively simple, without the complex cathode system of the mass-produced model, and the specifications of the targets used are also small, and the common specifications are: 2-4 inches in diameter , a thickness of about 6 mm. Therefore, the cooling system of the equipment is relatively simple, which puts forward higher requirements for the target binding, mainly the flatness of the target and the melting point of the binding layer. [0003] The target materials used in the test model are various, ranging ...

AI Technical Summary

Problems solved by technology

An increase in the binding temperature is likely to cause the following consequences: 1. Due to the thinner copper backplane of the target, the increase in platform temperature will cause the backplane to deform and cause uneven heating, and the target binding is easy to crack

2. The ceramic target is bound at a higher temperature, and the copper back plate is seriously deformed. Due to the fragile characteristics of the ceramic, it cannot be corrected, resulting in the flatness of the target that cannot meet the use requirements.

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