A kind of miniled substrate packaging method

Abstract

The invention discloses a method for encapsulating a miniled substrate, comprising the following steps: a material preparation step: preparing a double-sided copper-clad laminate, the thickness of the double-sided copper-clad laminate is 100-1000 μm, wherein the thickness of a single-layer copper foil is 12-35 μm; Hole step: drilling the double-sided copper-clad laminate, ensuring that the drilled hole runs through the two layers of copper foil of the double-sided copper-clad laminate; copper plating step: drilling the hole wall of the double-sided copper-clad laminate Copper plating, so that the copper plating layer located on the wall of the drilled hole connects the copper foils on both sides of the double-sided copper clad board, so that the copper foils on both sides of the double-sided copper clad board form an electrical connection; the hole filling step: use black Resin or black ink fills the drill holes; the black resin used in the step of making the anisotropic conductive adhesive melts and wraps the side of the miniled chip due to surface tension, thereby wrapping the chip independently and realizing mutual isolation between the chips .

Description

technical field [0001] The invention relates to a miniled substrate packaging method. Background technique [0002] The specifications of flip chips are getting smaller and smaller, and the gap between positive and negative electrodes is as small as 20 μm. At present, the minimum gap of ordinary silver paste or tin paste can only realize the placement with a gap of 50 μm between the positive and negative electrodes, and it is very difficult, which may easily cause a micro-short circuit between the positive and negative electrodes. [0003] The number of Miniled module chips is huge. For the traditional silver paste and solder paste process, during production, due to the long time of solid crystal, the solvent of the paste is easy to volatilize, resulting in the failure of placement. [0004] The red, green, and blue chips of the current Miniled module are not isolated from each other, and cross-light will form between pixels, resulting in color distortion or smearing, affec...

AI Technical Summary

Problems solved by technology

At present, the minimum gap of ordinary silver paste or tin paste can only achieve the placement with a positive and negative gap of 50 μm, and it is very difficult, which may easily cause a micro-short circuit between the positive and negative electrodes

[0003] The number of Miniled module chips is huge. For the traditional silver paste and solder paste process, during production, due to the long time of solid crystal, the solvent of the paste is easy to volatilize, resulting in the failure of placement.

[0004] The red, green, and blue chips of the current Miniled module are not isolated from each other, and crosslights will form between pixels, resulting in color distortion or smearing, affecting visual effects

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