Manufacturing method for PCB for charging pile

Abstract

The invention discloses a manufacturing method for a PCB for a charging pile. The manufacturing method comprises the following steps: S1, earlier-stage processing is carried out; S2, copper depositionis carried out; S3, blue glue pasting is carried out: a gold-plated area and a non-gold-plated area are preset on the PCB, a to-be-gold-plated bonding pad to be gold-plated is arranged on the presetgold-plated area, blue glue is pasted on the non-gold-plated area, and a copper layer is exposed in the gold-plated area; S4, first micro-etching and blue glue tearing off are carried out: the copperlayer in the gold-plated area is subjected to micro-etching, and the blue glue in the non-gold-plated area is torn off: S5, ink printing is carried out: the preset gold-plated area is covered by the ink and is then baked, and after exposure and development, the bonding pad to be gold-plated is exposed; S6, a dried film is selected and gold plating is carried out: the two sides of the PCB are covered with the dried film, the bonding pad to be gold-plated is exposed and developed, and gold plating is carried out after nickel plating is carried out on the bonding pad to be gold-plated; S7, film stripping and ink stripping are carried out; S8, second micro-etching is carried out; and S9, post-processing is carried out. According to the method, the conditions of gold infiltration and circuit infiltration and corrosion are avoided, the product quality is ensured, the production efficiency is improved, and the prepared PCB can bear large current.

Description

technical field [0001] The invention relates to the field of PCB boards, in particular to a method for manufacturing a PCB board for charging piles. Background technique [0002] Under the background of my country's vigorous promotion and application of new energy vehicles, China has become a huge market for the explosive growth of new energy vehicles in the world. Due to the promotion of new technologies such as big data and the Internet of Things, charging piles or charging stations are not only the first choice for new energy vehicles. The base configuration has become an important intelligent connection and contact point of "people, vehicles and services". Therefore, with smart charging piles as the starting point, based on big data and the Internet of Things, the construction of charging facilities has developed rapidly, and the demand for charging piles continues to grow. [0003] The charging pile is mainly composed of a pile body, a functional unit, a billing control...

AI Technical Summary

Problems solved by technology

[0004] Therefore, the PCB in the charging pile is required to withstand high current, and the contact wear resistance is better. Generally, thick copper and local pad gold plating are used. When the dry film is laminated, the dry film cannot completely fill the gap between the copper surface and the substrate, and there will be the following problems: (1) The liquid medicine will penetrate into the gap during gold plating, resulting in gold seepage; (2) When etching the lead The etching solution will seep into the junction of the line and the pad, causing the line to erode