Coating molding method for novel material layer structure of high-frequency circuit board and product thereof

Abstract

The invention discloses a coating molding method for a novel material layer structure of a high-frequency circuit board. The method comprises the steps that (1) a synthetic liquid film is coated on acopper foil; (2) baking in a tunnel oven is carried out to form a cured film on the copper foil to acquire a single panel; (3) a synthetic liquid high-frequency material layer is coated on the cured film; and (4) baking in the tunnel oven is carried out, and the synthetic liquid high-frequency material layer becomes a semi-cured high-frequency material layer to acquire the novel material layer structure of the high-frequency circuit board. The invention further discloses a product prepared by implementing the method. The prepared novel material layer structure of the high-frequency circuit board has the performance of transmitting high-frequency signals at high speed, can adapt to the current high-frequency and high-speed trend from wireless networks to terminal applications, and is particularly suitable for novel 5G technology products. The novel material layer structure can be used as a material for making circuit boards, and can be used to make a single-layer circuit board, a multilayer flexible circuit board, a multilayer soft-hard combined board and the like, which brings great convenience to circuit board production and simplifies the process.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a coating molding method of a novel material layer structure of a high-frequency circuit board and a product thereof. Background technique [0002] At present, from the communication network to the terminal application, the communication frequency is comprehensive and high-frequency, and high-speed and large-capacity applications emerge in endlessly. In recent years, with the transition of wireless networks from 4G to 5G, network frequencies have continued to increase. According to the 5G development roadmap shown in relevant materials, the future communication frequency will be upgraded in two stages. The goal of the first stage is to increase the communication frequency to 6GHz before 2020, and the goal of the second stage is to further increase it to 30-60GHz after 2020. In terms of market applications, the signal frequency of terminal antennas such as smartphones continues to ...

AI Technical Summary

Problems solved by technology

At present, polyimide (PI) is mainly used as the substrate of flexible boards. However, due to the large dielectric constant and loss factor of PI substrates, large moisture absorption, and poor reliability, the PI flexible boards The high-frequency transmission loss is serious and the structural characteristics are poor, which can no longer adapt to the current high-frequency and high-speed trend

Therefore, with the emergence of new 5G technology products, the signal transmission frequency and speed of existing circuit boards have been difficult to meet the requirements of 5G technology products

[0004] At the same time, in the preparation process, whether it is a traditional multi-layer flexible circuit board or a multi-layer soft-rigid combination board, there are generally many technological processes, complicated production, and problems such as increased power consumption and signal transmission loss in terms of circuit board performance.

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