Printed circuit board air-cooled heat exchanger core

A technology for air-cooled heat exchangers and printed circuit boards, which is used in indirect heat exchangers, heat exchanger types, heat exchange equipment, etc. The effect of short cycle time, large flow area and reduced processing cost

Pending Publication Date: 2020-01-17
XIAN THERMAL POWER RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the air side does not need to withstand high pressure, and the required channel area is large, if the air side channel is also etched through the channel, the etching depth will be very large, the processing difficulty and time will increase, and the cost will also increase. High pressure, machining the air side channel by the same process is also a waste

Method used

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  • Printed circuit board air-cooled heat exchanger core
  • Printed circuit board air-cooled heat exchanger core
  • Printed circuit board air-cooled heat exchanger core

Examples

Experimental program
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Embodiment Construction

[0022] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0023] Such as figure 1 figure 2 image 3 Shown: a printed circuit board air-cooled heat exchanger core, the core is composed of a number of high-pressure medium channels 1, a number of air channels 2, and a number of high-pressure channel head gasket strips 3. The high-pressure medium channel 1 is processed by vacuum diffusion welding process, the air channel 2 can be completed by stamping and other cheap processes, and finally the high-pressure medium channel 1, air channel 2, and high-pressure channel head cushion strip 3 are processed by diffusion welding Technology welded into a whole. The heat exchanger completed by this combined processing not only ensures that the high-pressure medium side channel has sufficient strength and can withstand high pressure, but also ensures that the air side has a sufficient flow area, and avoids a large number of etc...

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PUM

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Abstract

The invention discloses a printed circuit board air-cooled heat exchanger core. The core comprises multiple high-pressure medium channels, multiple air channels and high-pressure channel head cushionstrips. The high-pressure medium channels and the multiple air channels arranged in a spaced manner, the high-pressure medium channels are arranged on the topmost end and the bottommost end, and the high-pressure channel head cushion strips are arranged on the two sides of the air channels. When an air-cooled heat exchanger works, high-pressure media flow to the other end from one ends of the high-pressure medium channels, cold air flows to the other side from one sides of the air channels, the outer surface of metal plates of the high-pressure medium channels are transversely flushed, and thecooling effect is achieved. The heat exchanger core has the advantages of being resistant to high pressure, high in heat exchange coefficient, small in size and capable of saving cost and machining time.

Description

technical field [0001] The invention relates to the technical field of heat exchange devices, in particular to a printed circuit board air-cooled heat exchanger core. Background technique [0002] Printed circuit heat exchanger (PCHE) belongs to the category of microchannel plate heat exchanger. PCHE has the advantages of compact structure, high temperature resistance, high pressure resistance, safety and reliability, etc. It is widely used in refrigeration and air conditioning, oil and gas, nuclear industry, chemical industry, electric power industry and other fields. [0003] The heat exchange core is the core component of PCHE, and it has the structural characteristics of a porous core from the appearance structure. The micro-channels in the core provide flow channels for the heat transfer medium, while the matrix material (usually a metal plate) in the core plays the role of transferring heat between the heat transfer medium and the heat storage medium. The main proces...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D9/00F28F3/04
CPCF28D9/0037F28F3/048
Inventor 高炜张磊吴帅帅李红智杨玉
Owner XIAN THERMAL POWER RES INST CO LTD
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