Manufacturing method of optical coupling end face in three-dimensional integrated optical interconnection chip

Abstract

The method for manufacturing an optical coupling end face in a three-dimensional integrated optical interconnect chip provided by the present invention includes the following steps: providing a device wafer, the device wafer includes a front surface having a device structure and a back surface opposite to the front surface, and the The device wafer has through silicon vias extending from the front side to the back side; bonding the front side with a carrier wafer; forming spherical solder joints on the back side; etching the device from the back side wafer, forming a light coupling end face penetrating the device wafer. The invention simplifies the manufacturing process of the optical coupling end face in the three-dimensional integrated optical interconnect chip, improves the quality of the optical coupling end face, and reduces the manufacturing cost of the three-dimensional integrated optical interconnect chip.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method for manufacturing an optical coupling end face in a three-dimensional integrated optical interconnection chip. Background technique [0002] With the continuous development of science and technology, the feature size of semiconductor devices continues to shrink, and Moore's Law is getting closer to the physical limit. Therefore, it is becoming more and more difficult to improve chip integration only by reducing the size of devices. In order to solve this problem, a three-dimensional (Three Dimensional, 3D) integrated package emerges as the times require. Three-dimensional integrated packaging technology is one of the key development technologies in the future, and it is a key solution to realize chip miniaturization, overcome signal delay and break through the bottleneck of Moore's Law. The core idea of ​​three-dimensional integrated packaging is to ...

AI Technical Summary

Problems solved by technology

[0006] The invention provides a method for manufacturing an optical coupling end face in a three-dimensional integrated optical interconnection chip, which is used to solve the problem of complex manufacturing process of the optical coupling end face in the existing three-dimensional integrated optical interconnection chip, and at the same time improve the quality of the optical coupling end face

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