Unlock instant, AI-driven research and patent intelligence for your innovation.

A heat treatment method of ultra-high thermal conductivity composite material for high-power chip heat sink

A technology of heat-conducting composite materials and heat treatment methods, which is applied in the field of electronic packaging material preparation, can solve problems such as deformation, and achieve the effect of improving flatness, thermal conductivity, and thermal conductivity

Active Publication Date: 2021-06-04
QIQIHAR XIANGKE NEW MATERIAL CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem of deformation of large-size thin slices of diamond / aluminum composite materials used in existing high-power chip heat sinks after near-net molding, and to provide a heat treatment method for ultra-high thermal conductivity composite materials used in high-power chip heat sinks

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A heat treatment method of ultra-high thermal conductivity composite material for high-power chip heat sink

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0013] Specific implementation mode 1: In this implementation mode, a heat treatment method of ultra-high thermal conductivity composite material for high-power chip heat sink is realized according to the following steps:

[0014] 1. The large-size diamond / aluminum composite sheet prepared by pressure infiltration method and released from the mold is polished with fine sandpaper to remove surface impurities, then cleaned with absolute ethanol, and then arranged alternately with the mold, and put into the vacuum pressure equipment together Inside;

[0015] 2. Evacuate to 0.1-10Pa, raise the temperature to 500-600°C and keep it warm for 10-20min, give 0.1-2MPa bidirectional restraint extrusion, and start pressure-holding cooling when the temperature is higher than 400°C, the cooling rate is 5-10°C / min, when the temperature is cooled to below 400°C, release the pressure, then cool to 100°C at a rate of ≤2°C / min, start the furnace to take samples, and complete the heat treatment ...

specific Embodiment approach 2

[0020] Embodiment 2: This embodiment is different from Embodiment 1 in that the thickness of the large-size sheet of diamond / aluminum composite material in step 1 is 0.2 mm to 2 mm. Other steps and parameters are the same as those in Embodiment 1.

specific Embodiment approach 3

[0021] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the matrix alloy of the diamond / aluminum composite material in Step 1 is pure aluminum. Other steps and parameters are the same as those in Embodiment 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
surface smoothnessaaaaaaaaaa
surface smoothnessaaaaaaaaaa
Login to View More

Abstract

The invention relates to a heat treatment method of an ultra-high thermal conductivity composite material for a high-power chip heat sink, which belongs to the technical field of preparation of electronic packaging materials. It is to solve the problem of deformation of large-size thin slices of diamond / aluminum composite materials used in existing high-power chip heat sinks after near-net molding. Method: The large-size diamond / aluminum composite sheet prepared and demoulded by the pressure infiltration method is ground and cleaned, and placed alternately with the mold and placed in a vacuum pressure device; vacuuming, heating and heat preservation, bidirectional constrained extrusion, holding pressure and cooling, Open the furnace to sample. The invention adopts two-way constrained vacuum heat treatment, realizes the prevention and correction of the deformation of the large-size diamond / aluminum composite sheet after near net forming, can significantly improve the flatness and thermal conductivity of the composite sheet, is simple and easy to operate, and is suitable for large batches Production will help the promotion and application of diamond / aluminum composite materials, and better exert the excellent performance of the material. The invention is suitable for heat treatment of ultra-high thermal conductivity composite material for high-power chip heat sink.

Description

technical field [0001] The invention belongs to the technical field of preparation of electronic packaging materials, and in particular relates to a heat treatment method for an ultra-high thermal conductivity composite material used for a heat sink of a high-power chip. Background technique [0002] Diamond / aluminum composite materials have excellent characteristics such as high thermal conductivity, thermal expansion coefficient matching GaN chips, and low density, and have become important candidate materials for current high-power chip heat sinks. The existing technical path is to first use near-net-shaping technology to prepare large-size sheets of composite materials, and then use laser cutting to cut out the shape of the heat sink. However, due to the large thermal mismatch stress between diamond and aluminum during the preparation process, the introduction of external stress during demolding, and the low stiffness of the composite material itself, the stress release ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C22F1/04C22F1/02C22C21/00C22C26/00
CPCC22C21/00C22C26/00C22F1/02C22F1/04
Inventor 王平平陈国钦芶华松王刚
Owner QIQIHAR XIANGKE NEW MATERIAL CO LTD