Method for thermocompression curing molding of electronic equipment cables embedded in composite materials

Abstract

The invention discloses a method for embedding cables of electronic equipment into a composite material for thermocompression curing and molding, aiming to provide a process method capable of saving the wiring space of highly integrated electronic equipment. The present invention is realized through the following methods: select the high-temperature-resistant wire according to the three-dimensional wiring model of the cable network of the electronic equipment, and cut it according to the designed length; use the fluorination treatment process to perform surface treatment on the wire; cut the shape of the carbon fiber prepreg, and mold it in a composite material Mold release agent, then lay up the bottom prepreg in sequence, vacuumize and compact the vacuum bag, lay cables according to the three-dimensional wiring model, fill the middle layer with prepreg, lay up the upper layer of prepreg, isolation film and suction Adhesive material, lay air felt, sealing strip and vacuum film in sequence, start the autoclave to vacuum and maintain pressure, push the load into the autoclave, stick thermocouples to monitor the temperature of the mold and the tank, according to the set temperature, The pressure control curve maintains the heat preservation and pressure, and the cable is embedded in the composite material autoclave to be solidified and formed with the furnace cooling.

Description

technical field [0001] The invention relates to a thermocompression curing molding method for electronic equipment cables embedded in composite materials. Background technique [0002] The internal cable network of electronic equipment is the "nerve and blood vessel" of electronic equipment, which ensures the transmission of electrical energy and electrical signals. As an important transmission for the interconnection between electronic equipment and extension modules, cables are of great significance to ensure the stable operation of the system. How to reasonably arrange the cables inside the electronic equipment has become a problem that cannot be ignored in structural design. The structure of electronic equipment is complex, and there are many structures and electrical interfaces. Thousands of cable networks are required to realize the internal electrical interconnection of the product. The highly integrated and miniaturized electronic equipment completes the reasonable ...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a cable embedding composite material thermocompression curing molding for the needs of high integration, overall light weight and miniaturization of electronic equipment, using the designability of composite materials and the special process method of additive manufacturing The method can effectively reduce the number of internal wiring of electronic equipment and save wiring space, so as to solve the problem of difficult wiring in the process of high integration, overall light weight and miniaturization of electronic equipment

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