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Ka-band broadband low-profile dual-polarized microstrip antenna based on high-frequency lamination technology

A dual-line polarized, microstrip antenna technology, applied in antennas, antenna coupling, antenna components, etc., can solve the problems of low high frequency efficiency, single polarization characteristics, narrow bandwidth, etc., to achieve the effect of improving bandwidth

Active Publication Date: 2021-09-07
CNGC INST NO 206 OF CHINA ARMS IND GRP
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AI Technical Summary

Problems solved by technology

[0006] Aiming at the problems of narrow bandwidth, large loss, low efficiency in high frequency band, single polarization characteristic and unsuitable for millimeter wave application in the traditional planar microstrip antenna in the background technology, a novel Ka-band broadband based on high-frequency lamination technology is proposed. Low Profile Dual Linear Polarized Microstrip Antenna

Method used

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  • Ka-band broadband low-profile dual-polarized microstrip antenna based on high-frequency lamination technology
  • Ka-band broadband low-profile dual-polarized microstrip antenna based on high-frequency lamination technology
  • Ka-band broadband low-profile dual-polarized microstrip antenna based on high-frequency lamination technology

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Embodiment Construction

[0026] Now in conjunction with embodiment, accompanying drawing, the present invention will be further described:

[0027] The Ka-band broadband low-profile dual-line polarized microstrip antenna based on high-frequency lamination technology adopts a multi-layer microstrip structure with floor opening coupling feeding, including a square parasitic radiation patch, an inner metal floor, and an octagon Floor coupling cavity, stripline dual-polarized feeder, metal floor circular opening, metalized feed-through hole, metalized isolation via array, outer metal floor and SSMP connector. The entire antenna is composed of six layers of high-frequency dielectric substrates. The multi-layer board material is Taconic TSM-DS3 high-frequency dielectric substrate with dielectric constant εr=3. The boards are crimped by prepreg film. The selected prepreg material is Taconic FR-27 with a dielectric constant εr=2.7.

[0028]The top layer of the antenna is a square parasitic radiation patch, a...

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Abstract

The invention relates to a Ka-band broadband low-profile dual-line polarized microstrip antenna based on high-frequency lamination technology. The feeding structure consists of an octagonal floor coupling cavity, a stripline dual-polarization feeder, and a metallized feeding via hole. and the metal floor circular opening together, the stripline dual-polarized feeder terminal is a gradual coupling end, forming a multi-resonant multi-layer coupling structure with the octagonal floor coupling cavity; the metallized feed-through hole passes through the multi-layer high-frequency The circular opening on the dielectric board and the inner metal floor transmits the signal vertically from the stripline layer to the bottom of the antenna; the inner conductor of the SSMP connector is inserted into the metallized feeding via hole, and the outer conductor is welded to the underlying metal floor to This serves as the external electrical interface of the antenna. The antenna has a compact structure, small size, easy integration, low cost, and low processing difficulty. While working in a wide frequency band, it has dual-linear polarization radiation characteristics and can meet the application requirements of Ka-band broadband phased array systems or communication systems.

Description

technical field [0001] The invention relates to a Ka-band broadband low-profile dual-line polarized microstrip antenna based on high-frequency lamination technology, which can be used as a radiation unit of a Ka-band broadband phased array system and belongs to the technical field of wireless communication system antennas. Background technique [0002] With the rapid development and application of 5G communication and millimeter-wave sensor systems, millimeter-wave active phased arrays with fast beam-scanning and broadband coverage characteristics will become the main choice of hardware solutions. The overall performance of the active phased array system is inseparable from the characteristics of the selected antenna radiation unit: first, the matching and coupling characteristics of the unit determine the coverage of the working frequency band of the array; the lateral size of the unit determines the scanning of the array in the working frequency band Coverage; the polariza...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q1/36H01Q1/38H01Q1/48H01Q1/50H01Q15/24H01Q19/10H01Q1/52H01Q1/22
CPCH01Q1/22H01Q1/36H01Q1/38H01Q1/48H01Q1/50H01Q1/523H01Q15/24H01Q19/10
Inventor 王元源雷国忠华根瑞赵迎超
Owner CNGC INST NO 206 OF CHINA ARMS IND GRP
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