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Miniaturized artificial surface plasmon transmission line based on interdigital structure

An artificial surface plasmon and interdigitated structure technology, which is applied in the direction of electrical components, waveguide devices, waveguides, etc., can solve the problems of increasing the lateral size of the transmission line, increasing the restraint enhancement of the transmission line, and affecting the transmission efficiency of the transmission line, so as to improve the space utilization rate , Easy processing and low cost

Active Publication Date: 2020-02-28
HANGZHOU DIANZI UNIV
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

But at the same time as the cut-off frequency is reduced, the confinement of the transmission line to the wave is strengthened due to the increase of h, which leads to the reduction of the transmission distance
Adjusting the cutoff frequency by increasing h, or adding additional structures tends to increase the lateral dimension of the transmission line; affecting the transmission efficiency of the transmission line

Method used

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  • Miniaturized artificial surface plasmon transmission line based on interdigital structure
  • Miniaturized artificial surface plasmon transmission line based on interdigital structure
  • Miniaturized artificial surface plasmon transmission line based on interdigital structure

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Embodiment Construction

[0026] Such as figure 1 As shown, the miniaturized artificial surface plasmon transmission line based on the interdigitated structure includes a dielectric substrate, an artificial surface plasmon transmission line located on the surface of the dielectric substrate, and microstrip feeders arranged symmetrically at both ends of the transmission line; the first microstrip The feeder M0, the second microstrip feeder M1, and the metal strip M2 are located on the front of the dielectric substrate, and the first ground plate B0, the second ground plate B1, and the third ground plate B2 are located on the back of the dielectric substrate. Both the first microstrip feeder M0 and the second microstrip feeder M1 are provided with two, symmetrically installed at both ends of the metal strip M2, and the second microstrip feeder M1 is used to connect the first microstrip feeder M0 and the metal strip M2 . There are also two first grounding plates B0 and two second grounding plates B1, whi...

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Abstract

The invention relates to a miniaturized artificial surface plasmon transmission line based on an interdigital structure, which includes a dielectric substrate, a metal slotted line, two matching units, and two microstrip feeder lines. The metal slotted line and the matching units are located on the same side of the dielectric substrate. The microstrip feeder lines are located on the other side ofthe dielectric substrate. The two matching units each have an end connected to the metal slotted line, and each have the other end overlapping the two microstrip feeders, respectively. The two matching units and two microstrip feeder lines are symmetrically arranged at both ends of the metal slotted line. The metal slotted line includes a plurality of slotted units. The interdigital structure composed of a plurality of metal bars is arranged in the slotted units. The miniaturized artificial surface plasmon transmission line has high-efficiency transmission characteristics, achieves the cut-off characteristics of lower-frequency electromagnetic waves on the premise of keeping the line width dimension of the transmission line unchanged, realizes the miniaturization design of the transmission line, can quickly realize specific miniaturized artificial surface surface plasmon transmission lines of different degrees, has the characteristics of low crosstalk and high efficiency, improves thespace utilization rate, facilitates processing, and has low cost.

Description

technical field [0001] The invention belongs to the field of novel artificial electromagnetic materials, in particular to a miniaturized artificial surface plasmon transmission line based on an interdigitated structure. Background technique [0002] Surface plasmon polaritons (surface plasmon polaritons) are a special electromagnetic response generated at the interface between metal and dielectric. In the natural state, it generally exists in high-frequency bands such as near-infrared and optical bands, and manifests as a form of surface wave propagating along the metal surface at the interface between the metal and the medium. The electric field of the surface wave decays exponentially along the normal direction of the interface, which has a strong binding property. Due to the high-intensity confinement of light at subwavelength dimensions, surface plasmons are widely used to break through the diffraction limit and build various highly integrated optical components and cir...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P3/08
CPCH01P3/081
Inventor 潘柏操罗国清祝文涛蔡佳林廖臻
Owner HANGZHOU DIANZI UNIV
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