Repairable single-component epoxy structural adhesive and preparation method thereof, and application of repairable single-component epoxy structural adhesive

Abstract

The invention discloses a repairable single-component epoxy structural adhesive and a preparation method thereof, and application of a repairable single-component epoxy structural adhesive. The structural adhesive is mainly prepared from the following raw materials in percentage by weight: 15.0%-35.0% of bisphenol A or F epoxy resin, 15.0%-35.0% of polyurethane modified epoxy resin, 25.0%-35.0% ofa polymercaptan curing agent, 2.0%-4.0% of an accelerant, 1.0%-2.0% of a stabilizer, 4.0%-6.0% of a thixotropic agent and 1.0%-3.0% of a black pigment. The structural adhesive disclosed by the invention is mainly applied to adhesion of micro devices in small electronic products such as mobile phones, tablet personal computers, notebook computers, automobile display screens and the like, and has the characteristics that (1) the structural adhesive can be repaired; (2) the adhesive force is high; (3) the toughness is good; (5) low-temperature rapid curing (the curing condition at a temperatureof 80 DEG C for 10 min can be met); and (4) the operable time is long. The production process is simple, the efficiency is high, and large-scale production and application can be achieved.

Description

technical field [0001] The invention relates to the field of electronic adhesives, in particular to a reworkable one-component epoxy structural adhesive for bonding micro-devices in small electronic products such as mobile phones, tablets, notebook computers, and automotive display screens, and its preparation method and application . [0002] technical background [0003] At present, as mobile electronic products and automotive electronic products gradually enter the public's life, the demand for structural adhesives for bonding microelectronic devices is increasing. Compared with two-component adhesives, single-component structural adhesives have more uniform internal components and better consistency, and the electronic devices produced have more uniform performance and higher yields, so they are more suitable for various micro devices. bonding. In addition, these electronic products are required to be lighter and thinner, so plastics or composite materials are used to r...

AI Technical Summary

Problems solved by technology

[0004] Purpose of the invention: the present invention aims at the problem that the existing one-component epoxy structural adhesive is difficult to repair. The present invention provides a single-component epoxy structural adhesive that can be repaired. The single-component epoxy structural adhesive has the following characteristics: ( 1) High adhesion; (2) Good toughness; (3) Fast curing at low temperature (can meet the curing conditions of 10min@80°C); (4) Long operating time

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