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Repairable single-component epoxy structural adhesive and preparation method thereof, and application of repairable single-component epoxy structural adhesive

An epoxy structural adhesive, one-component technology, applied in the field of electronic adhesives, can solve the problems of difficult repair of one-component epoxy structural adhesives, and achieve the effects of reduced bond strength, reduced Tg value, and good storage.

Active Publication Date: 2020-03-17
南京金世家新材料科技有限公司
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] Purpose of the invention: the present invention aims at the problem that the existing one-component epoxy structural adhesive is difficult to repair. The present invention provides a single-component epoxy structural adhesive that can be repaired. The single-component epoxy structural adhesive has the following characteristics: ( 1) High adhesion; (2) Good toughness; (3) Fast curing at low temperature (can meet the curing conditions of 10min@80°C); (4) Long operating time

Method used

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  • Repairable single-component epoxy structural adhesive and preparation method thereof, and application of repairable single-component epoxy structural adhesive
  • Repairable single-component epoxy structural adhesive and preparation method thereof, and application of repairable single-component epoxy structural adhesive
  • Repairable single-component epoxy structural adhesive and preparation method thereof, and application of repairable single-component epoxy structural adhesive

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preparation example Construction

[0033] The preparation method of the epoxy structural glue of embodiment 1~6

[0034] Add bisphenol A or F epoxy resin, polyurethane modified epoxy resin, polythiol curing agent, heat stabilizer, thixotropic agent and black pigment to the double planetary mixer (Taiyi (Shanghai) Industrial Co., Ltd. Co., Ltd., model TSJ-5) in the stainless steel kettle, first open the circulating condensed water in the jacket of the kettle wall, and then open the mechanical stirring and high-speed dispersion plate. By adjusting the temperature and flow rate of the condensed water, the temperature of the material in the kettle is controlled not to exceed 30°C (the cooling water temperature and flow rate are adjusted according to the actual temperature in the kettle, if the temperature in the kettle is high, the temperature of the cooling water should be lowered, or the flow rate should be accelerated. Speed ​​up the heat dissipation and ensure that the temperature of the material in the kettle ...

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Abstract

The invention discloses a repairable single-component epoxy structural adhesive and a preparation method thereof, and application of a repairable single-component epoxy structural adhesive. The structural adhesive is mainly prepared from the following raw materials in percentage by weight: 15.0%-35.0% of bisphenol A or F epoxy resin, 15.0%-35.0% of polyurethane modified epoxy resin, 25.0%-35.0% ofa polymercaptan curing agent, 2.0%-4.0% of an accelerant, 1.0%-2.0% of a stabilizer, 4.0%-6.0% of a thixotropic agent and 1.0%-3.0% of a black pigment. The structural adhesive disclosed by the invention is mainly applied to adhesion of micro devices in small electronic products such as mobile phones, tablet personal computers, notebook computers, automobile display screens and the like, and has the characteristics that (1) the structural adhesive can be repaired; (2) the adhesive force is high; (3) the toughness is good; (5) low-temperature rapid curing (the curing condition at a temperatureof 80 DEG C for 10 min can be met); and (4) the operable time is long. The production process is simple, the efficiency is high, and large-scale production and application can be achieved.

Description

technical field [0001] The invention relates to the field of electronic adhesives, in particular to a reworkable one-component epoxy structural adhesive for bonding micro-devices in small electronic products such as mobile phones, tablets, notebook computers, and automotive display screens, and its preparation method and application . [0002] technical background [0003] At present, as mobile electronic products and automotive electronic products gradually enter the public's life, the demand for structural adhesives for bonding microelectronic devices is increasing. Compared with two-component adhesives, single-component structural adhesives have more uniform internal components and better consistency, and the electronic devices produced have more uniform performance and higher yields, so they are more suitable for various micro devices. bonding. In addition, these electronic products are required to be lighter and thinner, so plastics or composite materials are used to r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/08C08G59/66
CPCC09J163/00C09J11/08C08G59/66C08L2205/035C08L2205/025C08L2203/20C08L63/00C08L75/04
Inventor 杜尚霏刘伟
Owner 南京金世家新材料科技有限公司
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