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Single-component dual-curing-system organosilicon sealant

A dual-curing, silicone technology, used in adhesives, other chemical processes, chemical instruments and methods, etc., can solve the problems of high price, large amount of glue, high cost pressure of enterprises, and achieve good stability and improve adhesion. The effect of sex, guaranteed strength

Active Publication Date: 2020-03-20
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The overall market uses a huge amount of glue. At present, it mainly relies on imported products, and the price is high. However, the performance of domestic products cannot meet the requirements. The cost pressure of enterprises is very high, and cost reduction is imminent.

Method used

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  • Single-component dual-curing-system organosilicon sealant

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] Weigh 38g of methyl vinyl silicone resin as in structural formula (1), where a=1.0, b=0.22; 55g of the above-mentioned rubber base; 1.4g of crosslinking agent as in structural formula (2), with a viscosity of 80mPa.s, where m =0.7, n=1.2, m+n=1.9; 4.5g of adhesive such as structural formula (3), wherein K=7; inhibitor tetramethyldivinyl disiloxane 0.17g; add the above raw materials in sequence, After mixing evenly, lower the temperature of the colloid to room temperature; add 0.38 g of a platinum-vinylsiloxane complex catalyst with a platinum content of 5000 ppm, and mix evenly; then add 0.25 g of bis(2,4-dichlorobenzoyl) peroxide g, mixing evenly to obtain a silicone sealant, which is sealed and stored at room temperature.

Embodiment 2

[0054] Weigh 35g of methyl vinyl silicone resin with structural formula (1), where a=0.9, b=0.20; 50g of the above-mentioned rubber base; 1.3g of crosslinking agent with structural formula (2), viscosity is 50mPa.s, where m =0.6, n=1.4, m+n=2.0; 4.0g of adhesive such as structural formula (3), wherein K=5; inhibitor tetramethyldivinyl disiloxane 0.15g; add the above raw materials in sequence, After mixing evenly, lower the temperature of the colloid to room temperature; add 0.35 g of a platinum-vinylsiloxane complex catalyst with a platinum content of 5000 ppm, and mix evenly; then add 0.20 bis(2,4-dichlorobenzoyl) peroxide g, mixing evenly to obtain a silicone sealant, which is sealed and stored at room temperature.

Embodiment 3

[0056]Weigh 40g of methyl vinyl silicone resin with structural formula (1), where a=1.1, b=0.23; 50g of the above-mentioned rubber base; 1.5g of crosslinking agent with structural formula (2), viscosity is 100mPa.s, where m =0.8, n=1.1, m+n=1.9; 5.0g of adhesive such as structural formula (3), wherein K=8; inhibitor tetramethyldivinyl disiloxane 0.20g; add the above raw materials in sequence, After mixing evenly, lower the temperature of the colloid to room temperature; add 0.40 g of a platinum-vinylsiloxane complex catalyst with a platinum content of 5000 ppm, and mix evenly; then add 0.30 g of bis(2,4-dichlorobenzoyl) peroxide g, mixing evenly to obtain a silicone sealant, which is sealed and stored at room temperature.

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Abstract

The invention relates to a single-component dual-curing-system organosilicon sealant. The organosilicon sealant comprises the following raw materials in parts by mass: 4-5 parts of methyl vinyl silicone resin, 50-60 parts of base glue, 1.3-1.5 parts of a cross-linking agent, 4-5 parts of an adhesive, 0.15-0.2 part of an inhibitor, 0.35-0.40 part of a catalyst and 0.2-0.3 part of peroxide. The baseglue is prepared from the following components in parts by mass: 450 parts of methyl vinyl silicone oil A, 300 parts of methyl vinyl silicone oil B, 15 parts of hexamethyldisilazane and 150 parts offumed silica. The performance of the sealant prepared by the invention can reach or exceed the performance of imported products; the requirements of customer for performance and cost are met; and theorganosilicon sealant employs a hydrosilylation-peroxide dual-curing system, can be stored at low temperature and has excellent adhesion.

Description

technical field [0001] The invention relates to a one-component dual-curing system silicone sealant, in particular to a one-component silicone sealant with two curing systems of hydrosilicon addition and peroxide, low-temperature storage, and excellent adhesion. It belongs to the field of silicone sealants. Background technique [0002] In recent years, the automobile industry has developed rapidly. As the foundation of the development of the automobile industry, the auto parts industry has become a solid support to help China's independent automobile industry become bigger, stronger and better. A large number of foreign parts manufacturers have entered China, and the market is vast. The production process of auto parts involves many procedures and raw materials. Adhesives, as an important hub to connect various parts, are used more and more each year, and the market prospect is very good. [0003] Silicone sealant is a neutral curing silicone glue, which has good bonding s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J11/04C09J11/08C09J11/06C09K3/10
CPCC09J183/04C09J11/04C09J11/08C09J11/06C09K3/10C08L2205/035C08L2205/025C08L83/04C08K7/26C08K5/5419C08K5/14
Inventor 孙刚王建斌陈田安
Owner YANTAI DARBOND TECH
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