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A Dioxygen Welding Process Used for Chip Caps

A welding process and film header technology, applied in the field of carbon dioxide welding process, can solve the problems of low welding efficiency, low welding surface strength, and inconvenient promotion.

Active Publication Date: 2022-03-25
唐山大通金属制品有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a dioxygen welding process for the slit of the film head, which solves the problem of low welding efficiency, low strength of the welding surface and the difficulty of welding in the existing slit of the film. The process is complex and not easy to promote

Method used

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  • A Dioxygen Welding Process Used for Chip Caps

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] S1. Pretreatment of the sub-mother-end film head: make a groove for the sub-mother-portion film head, so that the V-shaped butt groove is formed between the sub-portion of the film head and the female head of the film head. The welding groove of the sub-mother-end film head and the surface of 20mm on both sides of the groove are polished with sandpaper. Luster, make the surface free of burrs, slag, oil, rust and other debris, and then rinse the groove with sodium hydroxide solution twice;

[0028] S2. Preheating before welding: use heating equipment to heat the area to be welded on the sub-mother-port header, and use a thermometer to monitor the surface temperature of the sub-mother-port header during heating, and wait until the sub-mother header surface temperature reaches 150 ℃;

[0029] S3. Welding environment control: use jet equipment to spray carbon dioxide gas, so that the area where the film header sub-port and the film header female port need to be welded are in...

Embodiment 2

[0036] S1. Pretreatment of the head of the mother and daughter: Make a groove for the head of the head and head, so that there is a V-shaped butt groove between the head of the head and the head of the head, and use the sandpaper to polish the surface of the welding groove of the head of the head and the head of 25mm on both sides of the groove with sandpaper. luster, so that the surface is free of burrs, slag, oil, rust and other debris, and then rinse the groove with sodium hydroxide solution 3 times;

[0037] S2. Preheating before welding: use the heating equipment to heat the area to be welded on the sub-mother header, use a thermometer to monitor the surface temperature of the sub-mother header during heating, and wait until the sub-mother header surface temperature reaches 165 ℃;

[0038] S3. Welding environment control: use jet equipment to spray carbon dioxide gas, so that the area where the film header sub-port and the film header female port need to be welded are in a...

Embodiment 3

[0045] S1. Pretreatment of the sub-mother mouth: Make a groove for the sub-molecular head, so that the sub-mold of the film head and the female head of the film head form a V-shaped butt groove, and the welding groove of the sub-mother head and the surface of 30mm on both sides of the groove are polished with sandpaper. Luster, make the surface free of burrs, slag, oil, rust and other debris, and then rinse the groove with sodium hydroxide solution 4 times;

[0046] S2. Preheating before welding: use the heating equipment to heat the area to be welded on the sub-mother header, use a thermometer to monitor the surface temperature of the sub-mother header during heating, and wait until the sub-mother header surface temperature reaches 180 ℃;

[0047] S3. Welding environment control: use jet equipment to spray carbon dioxide gas, so that the area where the film header sub-port and the film header female port need to be welded are in a carbon dioxide environment, and the carbon dio...

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Abstract

The invention discloses a oxygen-dioxide welding process for the slit of the chip, S1, the pretreatment of the slit of the slit: making a bevel on the slit of the slit, so that a V-shaped joint groove is formed between the slit of the slit and the slit of the slit, and the groove of the slit is formed. The welding groove of the chip head and the surface of 20-30mm on both sides of the groove are polished with sandpaper to produce a metallic luster, which relates to the technical field of radiator processing. The oxygen-dioxide welding process used in the film head and mouth uses carbon dioxide gas environment for welding, so that the current density is relatively large, the arc energy is concentrated, the melting efficiency of the welding wire is high, the penetration depth of the base metal is large, and the welding speed is fast. At the same time, There is less residue after welding, which improves the welding efficiency. Preheating the socket head before welding avoids the phenomenon of cracking of the socket head during welding. The high temperature resistant welding wire is used for welding, which improves the strength of the welding surface and improves the The ability to resist cold cracks, while the welding process is simple and easy to promote.

Description

technical field [0001] The invention relates to the technical field of radiator processing, in particular to a carbon dioxide welding process used for chip headers. Background technique [0002] The heating radiator is a terminal device that conducts heat into the room, and has become an indispensable part of life. The heating radiator is connected by a plurality of unit heat sinks. The radiating column is connected between the two radiating fin heads, and the unit radiating fins are welded to each other through the radiating fin heads. At present, the welding process for the radiating fin head sub-port is not very mature. [0003] The existing carbon dioxide welding process used for the die opening has low current density during welding, the arc energy is not concentrated enough, the melting efficiency of the welding wire is low, the penetration depth of the base metal is shallow, and the welding speed is slow. A large amount of welding slag is cleaned, which greatly reduc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K9/235B23K9/16B23K9/32
CPCB23K9/235B23K9/16B23K9/32
Inventor 于克跃
Owner 唐山大通金属制品有限公司