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High-barrier puncture-resistant irradiation crosslinking type multilayer heat shrinkage film and preparation method thereof

A heat-shrinkable film and puncture-resistant technology, which is applied in the packaging field, can solve the problem that the puncture-resistant effect cannot meet the needs of food packaging with sharp angles, and achieve good oxygen barrier performance, good oxygen barrier performance, and strong deformation resistance.

Inactive Publication Date: 2020-03-27
JIANGYIN BAOBO PACKING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Patent CN102700210A discloses a seven-layer co-extruded transparent high-barrier film and its preparation method. Although the preparation method is more environmentally friendly, the obtained transparent high-barrier film has good transparency and barrier performance, but the anti-puncture effect cannot meet the requirements of food with sharp angles. packaging requirements

Method used

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  • High-barrier puncture-resistant irradiation crosslinking type multilayer heat shrinkage film and preparation method thereof
  • High-barrier puncture-resistant irradiation crosslinking type multilayer heat shrinkage film and preparation method thereof

Examples

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Effect test

Embodiment 1

[0032] A high-barrier, puncture-resistant, radiation-crosslinked multilayer heat-shrinkable film, comprising a co-extruded first PE film layer 1, a first adhesive film layer 2, a first PA film layer 3, an intermediate EVOH film layer 4, The second PA film layer 5, the second adhesive film layer 6 and the second PE film layer 7;

[0033] The total thickness of the heat-shrinkable film is 200 μm, wherein the thickness of the first PE film layer is 80 μm, the thickness of the first adhesive film layer is 4 μm, the thickness of the first PA film layer is 10 μm, and the thickness of the EVOH film layer is 12 μm. The thickness of the PA film layer is 10 μm, the thickness of the second adhesive film layer is 4 μm, and the thickness of the second PE film layer is 80 μm.

[0034] (1) Multi-layer co-extrusion blown film: the first PE film layer or the second PE film layer, mix the polyethylene raw materials and put them into the hopper of the extruder, melt them at 200-220°C, and enter ...

Embodiment 2

[0041] The difference between embodiment 2 and embodiment 1 is:

[0042] A high-barrier, puncture-resistant, radiation-crosslinked multilayer heat-shrinkable film, the total thickness of the heat-shrinkable film is 200 μm, wherein the thickness of the first PE film layer is 40 μm, the thickness of the first adhesive film layer is 20 μm, and the first The thickness of the PA film layer is 30 μm, the thickness of the EVOH film layer is 20 μm, the thickness of the second PA film layer is 30 μm, the thickness of the second adhesive film layer is 20 μm, and the thickness of the second PE film layer is 40 μm.

[0043] (1) Multi-layer co-extrusion blown film: the first PE film layer or the second PE film layer, mix the polyethylene raw materials and put them into the hopper of the extruder, melt them at 200-220°C, and enter the die; the first For the adhesive film layer or the second adhesive film layer, add maleic anhydride-modified polyethylene into the hopper of the extruder, melt...

Embodiment 3

[0050] The difference between embodiment 3 and embodiment 1 is:

[0051] A high-barrier, puncture-resistant, radiation-crosslinked multilayer heat-shrinkable film, the total thickness of the heat-shrinkable film is 100 μm, wherein the thickness of the first PE film layer is 30 μm, the thickness of the first adhesive film layer is 5 μm, and the first The thickness of the PA film layer is 10 μm, the thickness of the EVOH film layer is 10 μm, the thickness of the second PA film layer is 10 μm, the thickness of the second adhesive film layer is 5 μm, and the thickness of the second PE film layer is 30 μm.

[0052] (1) Multi-layer co-extrusion blown film: the first PE film layer or the second PE film layer, mix the polyethylene raw materials and put them into the hopper of the extruder, melt them at 200-220°C, and enter the die; the first For the adhesive film layer or the second adhesive film layer, add maleic anhydride-modified polyethylene into the hopper of the extruder, melt i...

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Abstract

The invention discloses a high-barrier puncture-resistant irradiation crosslinking type multilayer heat shrinkage film. The multilayer heat shrinkage film comprises a first PE film layer, a first adhesive film layer, a first PA film layer, a middle EVOH film layer, a second PA film layer, a second adhesive film layer and a second PE film layer which are formed through coextrusion; the total thickness of the multilayer heat shrinkage film is 30-200 [mu]m, and the respective thickness of the first PE film layer and the second PE film layer is 5-40% of the total thickness; and the respective thickness of the first adhesive film layer and the second adhesive film layer is 2-10% of the total thickness, the respective thickness of the first PA film layer and the thickness of the second PA film layer is 2-15% of the total thickness, and the thickness of the EVOH film layer is 2-10% of the total thickness. The provided multilayer heat shrinkage film has high barrier properties and excellent puncture resistance.

Description

technical field [0001] The invention relates to the technical field of packaging, in particular to a high-barrier, puncture-resistant, radiation-crosslinked, multilayer heat-shrinkable film and a preparation method thereof. Background technique [0002] The existing high-barrier puncture-resistant heat-shrinkable films are PE / PE / PE, PP / PE / PP or PE / PVDC / PE, PE / EVOH / PE. The former two have poor barrier properties and poor puncture resistance, while the latter two The puncture resistance of the film is poor, and the existing high-barrier puncture-resistant heat shrinkable film is difficult to pack foods with sharp angles, such as meat with bones, fish and nuts. [0003] Multi-layer co-extrusion film is produced by multi-layer co-extrusion process, which has excellent barrier properties, mechanical properties, forming properties, and heat-sealing properties, and does not require additional compounding processes during processing, and does not involve inks, adhesives, and additiv...

Claims

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Application Information

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IPC IPC(8): B32B27/08B32B27/30B32B27/32B32B27/34B32B7/12B32B33/00B29C55/28B29C35/10B29L7/00B29L9/00
CPCB29C35/0866B29C35/10B29C55/28B29C2035/0877B29L2007/00B29L2009/00B32B7/12B32B27/08B32B27/306B32B27/32B32B27/34B32B33/00B32B2250/24B32B2250/40B32B2307/54B32B2307/558B32B2307/7244B32B2307/736B32B2439/70
Inventor 翟庆盼陈波王清齐家鹏余文健董亮亮
Owner JIANGYIN BAOBO PACKING
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