A kind of ceramic packaging base material composition and its application

A material composition and ceramic packaging technology, applied in the field of ceramics, can solve the problems of difficult dispersion process, high price, and difficult material acquisition, and achieve the effects of reducing stress failure points, promoting anisotropic growth, and reducing the proportion of liquid phase

Active Publication Date: 2022-01-07
CHAOZHOU THREE CIRCLE GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, by adding nano-scale particles, zirconia phase or whisker toughening, there will be problems such as difficult dispersion process, difficult material acquisition and high price

Method used

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  • A kind of ceramic packaging base material composition and its application
  • A kind of ceramic packaging base material composition and its application
  • A kind of ceramic packaging base material composition and its application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～8

[0027] The mass percent of each component in Examples 1-8 is shown in Table 1.

[0028] The preparation method of Examples 1-8 is as follows: (1) mixing the components contained in the ceramic package base material composition to obtain the ceramic package base material composition;

[0029] (2) uniformly mixing the ceramic packaging base material composition obtained in step (1) with a solvent and a dispersant, then adding resin and a plasticizer and mixing uniformly to obtain a mixture;

[0030] (3) tape-casting the mixture obtained in step (2) to obtain a green body;

[0031] (4) Punching the green body obtained in step (3), filling via holes, stacking and printing metal paste, and then sintering it into porcelain to obtain a ceramic packaging base.

Embodiment 1

[0048] Example 1 has the best overall performance, and no chipping will occur when the grinding wheel is cut into pieces. That is, when the composition is composed of the following components in mass percentage: 2.3% silicon dioxide, 3.7% chromium trioxide, 0.65% calcium oxide, 0.3% molybdenum, 0.8% manganese dioxide, 0.15% magnesium oxide, three When the ferric oxide is 0.1%, the titanium dioxide is 0.1%, and the aluminum oxide is 91.9%, the overall performance of the prepared ceramic package base is the best, and no chipping will occur when the grinding wheel is cut into slices.

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PUM

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Abstract

The invention relates to a ceramic packaging base material composition, which comprises the following components in mass percentage: 1.6%-3.0% of silicon dioxide, 3.4%-6.4% of dichromium trioxide, and 0.25% of calcium oxide ~1%, molybdenum 0.2%~0.5%, manganese dioxide 0.5%~2%, and the balance is alumina. The present invention is by adding appropriate MnO in the ceramic raw material 2 , promote the anisotropic growth of crystal grains, form long rod-shaped crystals, cause the cracks in the ceramic package base to shift, change and increase the path of crack propagation, thereby passivating the propagation of cracks; at the same time, reduce the liquid in the sintering process Compared with the ratio, the reduction of amorphous phase aggregates in the ceramic body to form stress failure points. Therefore, the ceramic packaging base of the present invention does not have problems such as chipping when the grinding wheel is cut into pieces.

Description

technical field [0001] The invention relates to a ceramic packaging base material composition and application thereof, belonging to the technical field of ceramics. Background technique [0002] Electronic products are ubiquitous in modern life, and the precision requirements of electronic components are high. In order to ensure that they are not disturbed by the external environment, ensure working accuracy and prolong working life, it is necessary to install electronic components on the ceramic packaging base. And package the electronic components. For example, in a surface acoustic wave filter (SAW), it is necessary to use a ceramic package base to hermetically package the chip, which plays the role of electrical connection, signal transmission and protection of the chip. The common ceramic package base adopts pre-pressing groove in the process of green body processing, so that the ceramic package base composite board can be divided into pieces along the pre-pressing gro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B35/10C04B35/622C04B41/88
CPCC04B35/10C04B35/622C04B41/51C04B41/88C04B2235/3418C04B2235/3241C04B2235/3208C04B2235/3267C04B2235/404
Inventor 邱基华陈烁烁李钢
Owner CHAOZHOU THREE CIRCLE GRP
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