Device for testing heat conductivity coefficient and contact thermal resistance of gas diffusion layer in compressed state

A gas diffusion layer and thermal conductivity technology, applied in the direction of material thermal conductivity, material thermal development, etc., can solve the problems of large size, complex structure, and measurement error of operating instruments, and achieve easy disassembly and assembly, high thickness measurement accuracy, and assembly and the effect of easy disassembly

Pending Publication Date: 2020-03-27
SUNRISE POWER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] According to the existing test device proposed above, the thickness of the test sample is usually required to be more than 1 mm, while the thickness of the gas diffusion layer is usually within 0.2 mm, which cannot meet the test requirements; it is impossible to accurately control the pressure applied on the sample surface and accurately obtain the pressure of the sample under compression. Actual thickness; in the measurement process, the contact thermal resistance between the sample and the contact surface is usually ignored, which brings a large error to the measurement, and the material in contact with the sample cannot be replaced according to actual needs, and the contact thermal resistance between different materials and the gas diffusion layer is tested ; The operating instrument is usually large in size and complex in structure, which is difficult to implement and operate, so a test device for the thermal conductivity and contact thermal resistance of the gas diffusion layer in the compressed state is provided

Method used

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  • Device for testing heat conductivity coefficient and contact thermal resistance of gas diffusion layer in compressed state
  • Device for testing heat conductivity coefficient and contact thermal resistance of gas diffusion layer in compressed state
  • Device for testing heat conductivity coefficient and contact thermal resistance of gas diffusion layer in compressed state

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Embodiment 1

[0067] like Figure 1-5 As shown, a test device that can test the thermal conductivity and contact thermal resistance of the gas diffusion layer in the compressed state. The effective thermal conductivity of the gas diffusion layer under different pressures and the contact thermal resistance between the gas diffusion layer and bipolar plates of different materials can be tested by using the testing device. The test device is designed based on the test method of steady-state heat flow method. The testing device is mainly used in conjunction with the universal testing machine, and can be assembled on the universal testing machine to provide the required pressure in the testing process through the universal testing machine. The universal testing machine is a prior art, not shown in the figure. The testing device is equipped with an extensometer 12, which can measure the deformation of the sample thickness under different pressures. The heat flow passing through the sample is re...

Embodiment 2

[0076] Different from Embodiment 1, the cooling medium and the heat exchange medium in this embodiment are both ethylene glycol. The material of the upper heat flow column 4 and the lower heat flow column 5 is electrolytic iron. The upper heat flow column 4 and the lower heat flow column 5 have a temperature measuring circular hole with a diameter of 1mm every 10mm along the axial direction. Both the upper heat flow column 4 and the lower heat flow column 5 are processed with external threads on the sides at a distance of 6 mm from their end faces.

[0077] In this embodiment, the thickness of the replaceable test head 8 is 1 mm, and there is a temperature measuring groove 0.5 mm away from the upper end surface of the replaceable test head 8, and the material of the replaceable test head 8 is carbon-plated metal.

[0078] In this embodiment, the material of the thermal insulation pad 10 and the thermal insulation cover 6 is asbestos. The length of the heat insulating cover 6...

Embodiment 3

[0080] A test device for thermal conductivity and thermal contact resistance of a gas diffusion layer in a compressed state, the specific structure of which is as follows Figure 1-4As shown, the device can be used in conjunction with a universal testing machine, which provides the required pressure during the test. During the test, select the test head made of the material that needs to measure the contact thermal resistance, screw the two test heads on the end faces of the upper heat flow column 4 and the lower heat flow column 5 respectively, and the interface between the test head and each heat flow column end surface needs to be in good thermal contact , to ensure that the heat flow can be completely transferred to the test head. Insert the miniature thermocouple 9 into the temperature measuring tank of each test head, and use silica gel to seal the temperature measuring tank to fix the miniature thermocouple 9 to prevent the miniature thermocouple 9 from falling during t...

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Abstract

The invention provides a device for testing the heat conductivity coefficient and the contact thermal resistance of a gas diffusion layer in a compressed state. The device comprises a heating unit, acooling unit, a heat flow column, a heat insulation cover, a temperature measuring unit, an extensometer and a data processing unit; the heating unit comprises a heat insulation cushion block, a heating water tank and a heating constant-temperature water tank; the cooling unit comprises a cooling water tank with a connector at the top and a cooling constant-temperature water tank; the heat flow column comprises an upper heat flow column and a lower heat flow column, the lower end of the upper heat flow column and the upper end of the lower heat flow column are in threaded connection with replaceable test heads, and a test sample is clamped between the replaceable test heads at the upper and lower ends; the heat insulation cover comprises an upper heat insulation cover and a lower heat insulation cover; the temperature measuring unit comprises a plurality of armored thermal resistors and a miniature thermocouple; and the data processing unit is electrically connected with the temperature measuring unit and the extensometer. The device is simple in structure, is combined with a universal testing machine for use, controls the pressure with high precision, and can test the effective heat conductivity coefficient of the gas diffusion layer in a compressed state.

Description

technical field [0001] The invention relates to the technical field of fuel cells, in particular to a test device for the thermal conductivity and contact thermal resistance of a gas diffusion layer in a compressed state. Background technique [0002] During the operation of the proton exchange membrane fuel cell, it is easy to cause the proton exchange membrane to lose water due to the high local current density and high temperature, resulting in a decrease in battery performance. The gas diffusion layer is one of the important components of the proton exchange membrane fuel cell. Eliminating the waste heat generated during the operation of the cell is one of the important functions of the gas diffusion layer. Therefore, measuring the thermal conductivity of the gas diffusion layer is crucial in the development of the fuel cell. important. Since the gas diffusion layer is a porous medium, it will deform during the battery assembly process, resulting in a change in its effe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/20G01N25/18
CPCG01N25/18G01N25/20
Inventor 李梦凡刘穆誉王倩陈桂银于鸣琦聂颖
Owner SUNRISE POWER CO LTD
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