Wafer position identification system and method

Abstract

The invention provides a wafer position identification system and method. The system comprises a wafer bearing module, a light source module, and an optical detection module, the wafer bearing modulecomprises a plurality of storage positions which are overlapped along a vertical direction and is provided with an opening, the light source module is arranged at one side of the opening and is used for emitting the parallel detection light, and the optical detection module is arranged at one side, opposite to the light source module, of the opening and is used for at least acquiring an image of awafer when the wafer is conveyed to pass through the opening, and judging whether the conveying position of the wafer meets a control requirement or not according to the acquired image. By detectingthe conveying position of the wafer on line and in time in the wafer conveying process, the problems that the wafer with the inaccurate conveying position is conveyed to the storage position, and consequently the wafer is scratched, laminated or inclined, can be solved, and the yield of the wafer is increased. Moreover, the system and the method operate during the conveying process, so that the conveying efficiency is not influenced.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer position identification system and method. Background technique [0002] Semiconductor Manufacturing Process A typical manufacturing process includes multiple steps, including deposition, cleaning, ion implantation, etching, and passivation. These steps are usually performed by different semiconductor equipment, such as chemical vapor deposition equipment, ion implantation equipment, or etching equipment. Usually, after one process is completed, the wafer needs to be placed in a FOUP (cassette for short), and the FOUP is transported to the next process equipment by the wafer transfer equipment. [0003] Existing wafer transfer boxes are usually provided with multiple storage positions for storing wafers, and the wafers are transferred to the storage positions one by one by a special wafer transfer module. Since multiple storage positions overlap in the...

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Problems solved by technology

[0004] The purpose of the present invention is to provide a wafer position recognition system and method, which can detect and prevent the position deviation of the wafer during the transfer process in time, which will lead to the problems of wafer scratches, stacking or skewing

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