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Polyimide film and preparation method thereof, and base film of radio frequency flexible printed circuit

A technology of polyimide film and polyamic acid resin, which is applied in the direction of printed circuit, printed circuit, circuit substrate material, etc., can solve the problems of liquid crystal phase change easily, high frequency signal transmission loss, high dielectric loss, etc.

Active Publication Date: 2020-04-03
ZHONGTIAN ELECTRONICS MATERIALS CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the liquid crystal polymer film has outstanding high-frequency transmission performance, the dielectric constant and dielectric loss of the prepared multilayer radio frequency printed circuit deviate from the design value due to the easy change of its liquid crystal phase state at high temperature. and difficult to precisely control
Due to the high dielectric loss of the polyimide base film of the traditional polyimide film copper clad laminate, the high-frequency signal transmission loss is large, which cannot meet the requirements of high-frequency signal transmission.

Method used

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  • Polyimide film and preparation method thereof, and base film of radio frequency flexible printed circuit
  • Polyimide film and preparation method thereof, and base film of radio frequency flexible printed circuit
  • Polyimide film and preparation method thereof, and base film of radio frequency flexible printed circuit

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preparation example Construction

[0036] see figure 1 , figure 1 It is a schematic flow diagram of the preparation method of the polyimide film in one embodiment of the present invention, specifically comprising the following steps:

[0037] S11, prepare the polyamic acid resin solution, filter and set aside, the solid content of the polyamic acid resin solution is controlled within the range of 15-35wt.%, and the viscosity is controlled at 10-45x10 4 Within the range of mPa·s;

[0038] S12, weighing a certain amount of polyamic acid resin solution, performing imidization after vacuum defoaming, to obtain a self-supporting semi-cured film;

[0039] S13, fixing the obtained self-supporting semi-cured adhesive film on the frame, heating the self-supporting semi-cured adhesive film to a set temperature, and then cooling to room temperature to obtain a polyimide primary film;

[0040] S14, annealing the obtained primary polyimide film to obtain a polyimide film.

[0041] see figure 2 , in one embodiment, th...

Embodiment 1

[0070] Add 1.3g of 4,4'-diaminodiphenyl ether (4,4-ODA) solid powder, 30.2g of bis(2-trifluoromethyl-4-amino Phenoxy)benzene (6FAPB) solid powder and 200ml N,N-dimethylformamide solvent, stirring and dissolving at 35°C to form a homogeneous aromatic diamine solution; weigh 15.3g pyrene dianhydride (PMDA ) solid powder, add it to the homogeneous aromatic diamine solution in batches under stirring, stir and react at 35°C for 1-24h to form an intermediate resin solution; weigh 5.5g p-phenylenediamine (PDA) solid powder material, add it to the above-mentioned intermediate resin solution under stirring; weigh 11.4g of pyrene dianhydride (PMDA) solid powder, add it to the above-mentioned intermediate resin solution under stirring, and form after a certain period of reaction Viscous polyamic acid resin (PAA) solution.

[0071] Weigh 1.1g PMDA, dissolve it in 16.3ml N,N-dimethylformamide solvent, add it to the above-mentioned polyamic acid resin solution in batches under stirring, an...

Embodiment 2

[0074] Add 2.6g of 4,4'-diaminodiphenyl ether (4,4-ODA) solid powder, 28.1g of bis(2-trifluoromethyl-4- Aminophenoxy)benzene (6FAPB) solid powder and 200ml N,N-dimethylformamide solvent, stirred and dissolved at 35°C to form a homogeneous aromatic diamine solution; weigh 28.5g pyrene dianhydride ( PMDA) solid powder, add it in batches to the homogeneous aromatic diamine solution under stirring, stir and react at 35°C for 1-24h to form an intermediate resin solution; weigh 5.6g of p-phenylenediamine (PDA) solid Powder, dissolve it in 23.6mL DMF solvent, add it to the above-mentioned intermediate resin in batches under stirring, react for 1-24h under stirring to form a viscous polyamic acid resin solution, and the solid content of the resin is controlled at 23wt.%, the viscosity is controlled at 10×10 4 mPa s.

[0075] Take by weighing sufficient amount of above-mentioned polyamic acid resin solution (PAA) solution according to the selected support size and coating thickness, ...

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Abstract

The invention relates to a preparation method of a polyimide film. The preparation method comprise the steps of: preparing a polyamic acid resin solution, filtering the solution for later use, controlling the solid content of the polyamic acid resin solution within the range of 15-35 wt%, and controlling the viscosity within the range of 10-45x104mPa.s; weighing a certain amount of the polyamic acid resin solution, carrying out vacuum defoaming, and carrying out imidization to obtain a self-supporting semi-cured adhesive film; fixing the self-supporting semi-cured adhesive film on a frame, heating the self-supporting semi-cured adhesive film to a set temperature, and cooling the self-supporting semi-cured adhesive film to room temperature to obtain a polyimide primary film; and carrying out annealing treatment on the obtained polyimide primary film to obtain the polyimide film. The polyimide film the preparation method thereof, and a base film of a radio frequency flexible printed circuit are not limited to one preparation method, and the prepared polyimide film has the characteristics of low dielectric constant, low dielectric loss, low thermal expansion coefficient and the like,is excellent in comprehensive performance, and meets the use requirements of the high-frequency flexible radio frequency printed circuit.

Description

technical field [0001] The invention relates to the field of polymer materials, in particular to a polyimide film, a preparation method thereof and a base film of a radio frequency flexible printed circuit. Background technique [0002] With the rapid development of high-frequency communication technology, the signal transmission loss of flexible RF printed circuit boards at high frequencies exceeds that of metal conductors, and reducing the high-frequency transmission loss of thin-film substrate materials has become an urgent technical problem to be solved. Flexible radio frequency printed circuits usually use high heat-resistant polyimide film or liquid crystal polymer film as the base film. After bonding conductive copper foil on the surface to form a flexible copper clad laminate, the copper foil is etched into a conductive layer by photolithography. made after the line. Although the liquid crystal polymer film has outstanding high-frequency transmission performance, th...

Claims

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Application Information

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IPC IPC(8): C08J5/18C08J7/00C08G73/10H05K1/03C08L79/08
CPCC08G73/1028C08G73/1039C08G73/1042C08G73/1067C08G73/1071C08J5/18C08J7/08C08J2379/08H05K1/0346H05K2201/0154
Inventor 曾彩萍付高辉刘贺曹义杨继明金鹰薛驰
Owner ZHONGTIAN ELECTRONICS MATERIALS CO LTD
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