Metal copper microchannel heat sink with comb-tooth structure and manufacturing method thereof
A manufacturing method and microchannel technology, which can be used in cooling/ventilation/heating transformation, electrical equipment construction parts, electrical components, etc., and can solve the problem that SU-8 photoresist is difficult to remove flow resistance, etc.
Active Publication Date: 2022-03-29
DALIAN UNIV OF TECH
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Problems solved by technology
[0005] In order to solve the problem that the SU-8 photoresist is difficult to remove and the flow resistance is large during the production process of the metal copper microchannel heat sink, the present invention proposes a metal copper microchannel heat sink with a comb-tooth structure and a manufacturing method, namely Fabricate microchannel structures on two metal copper substrates, align and package the two substrates through the grooves and protrusions respectively set on the substrates to form metal copper microchannels with a comb-tooth structure, and the microchannels on each substrate The width is wide, which is convenient for the removal of SU-8 glue, and the micro-channel of the comb structure is beneficial to reduce the flow resistance to the cooling medium
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[0029] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0030] like figure 1 , as shown in 2, the base plate 1 is made of copper, which is made into a cuboid substrate of 6cm×6cm×0.5cm by wire cutting process. Through standard processes such as substrate grinding, polishing, coating, photoresist exposure, and development, the film is patterned and the conductive substrate is exposed. On the base plate 1 with SU-8 photoresist microstructure, the micro-electroforming of copper is carried out, and the groove structure 3 and the base plate microchannel structure 4 are processed. The groove width of the groove structure 3 is 1.75 mm, and the height is 0.5 mm. mm, the bottom plate microchannel structure 4 is composed of 100 bottom plate microwalls 9, each bottom plate microwall 9 is 2 cm long, 100 μm wide, and 500 μm high, and the distance between adjacent bottom plate microwalls 9 is 400 μm. Use SU-8 ...
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Abstract
The invention discloses a metal copper micro-channel heat sink with a comb-tooth structure and a manufacturing method thereof, belonging to the technical field of micro-manufacturing. By fabricating microchannel structures on two metal copper substrates, aligning the grooves and raised structures on the substrates and encapsulating the two substrates, a metal copper microchannel with a comb-tooth structure is formed. Microchannels on each substrate The width of the channel is wide, which is convenient for the removal of SU‑8 glue, and the microchannel of the comb structure is beneficial to reduce the flow resistance to the cooling medium. The present invention solves the existing metal copper microchannel heat sink based on UV-LIGA technology. Because of its small line width and large aspect ratio, on the one hand, SU-8 glue is difficult to remove after the electroforming process is completed. ; On the other hand, the flow resistance of the metal copper microchannel heat sink with small line width is relatively large.
Description
technical field [0001] The invention belongs to the technical field of micro-manufacturing, and relates to a metal copper micro-channel heat sink with a comb-tooth structure and a manufacturing method. Background technique [0002] At present, metal copper microchannels are mainly fabricated by UV-LIGA, micromachining, micro-EDM, and micro-electrolytic machining. The width of metal copper microchannels fabricated by micro-machining, micro-EDM and micro-electrolytic machining is usually more than 200 μm. The UV-LIGA process based on SU-8 photolithography and micro-electroforming technology has unique advantages in ensuring the patterning accuracy and structural quality of the microchannel, so the UV-LIGA process is often used for small line width and large aspect ratio. , Fabrication of metal copper microchannels with small surface roughness and high verticality of side walls. [0003] The metal copper microchannel fabricated by UV-LIGA process has the characteristics of sm...
Claims
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IPC IPC(8): B23P15/00H05K7/20
CPCB23P15/00H05K7/20336
Inventor 杜立群白志鹏翟科曹强张希王舒萱温义奎
Owner DALIAN UNIV OF TECH