Packaging method and packaging structure
A packaging method and connection structure technology, applied in radiation control devices, electrical components, diodes, etc., can solve the problems of low device yield and poor stability, and achieve the effects of improving yield, avoiding impact, and improving process stability.
Active Publication Date: 2020-04-14
NINGBO SEMICON INT CORP
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Problems solved by technology
[0004] However, the stability of the current packaging method is poor, and the yield of the formed device is low
Method used
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[0027] The process stability of the packaging structure formed by the current packaging method is poor, and the yield rate of the formed device is low. The reasons for the poor process stability of the packaging structure and the low yield rate of the device are analyzed in combination with a packaging method.
[0028] refer to Figure 1 to Figure 2 , showing a schematic structural diagram corresponding to a packaging method in the prior art, wherein, refer to figure 1 As shown in the front cross-sectional view of the chip 1 , the front side of the chip 1 includes a photosensitive area 10 and a plurality of conductive pads 11 surrounding the photosensitive area 10 . combined reference figure 2 , in the chip packaging process, the chip 1 is packaged into the space formed by the substrate 2 , the supporting sidewall 3 and the light-transmitting substrate 4 . In order to realize the electrical connection of the chip 1 , a wire bonding (wire bonding) process is generally used,...
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Abstract
The embodiment of the invention provides a packaging method and a packaging structure. The method comprises the steps that a light-transmitting substrate, a chip and a device substrate are provided, afront surface of the chip includes a photosensitive area and a peripheral area surrounding the photosensitive area, a conductive pad is arranged in the peripheral area, and the front surface of the device substrate includes a chip connecting circuit used for being electrically connected with the conductive pad; a supporting frame is formed on the light-transmitting substrate, wherein the supporting frame includes a supporting area, a bonding pad leading-out area and a window area; a bonding pad connection structure extending from the support area to the bonding pad lead-out area is formed onthe support frame; the front surface of the chip is inversely arranged on the supporting area of the supporting frame; and the conductive pad is correspondingly connected with the bonding pad connecting structure of the support area, the bonding pad leading-out area of the support frame is fixed on the front surface of the device substrate, and the bonding pad connecting structure is correspondingly connected with the chip connecting circuit. Process stability is improved, and a yield of a device is further increased.
Description
technical field [0001] Embodiments of the present invention relate to the field of semiconductor manufacturing, and in particular, to a packaging method and a packaging structure. Background technique [0002] The image sensor (CIS: CMOS Image Sensor) is a sensor that uses the photosensitive material on the surface of the CIS chip to convert the perceived external light into an electrical signal. After the CIS chip is manufactured, it is usually necessary to package the CIS chip for use in electronic devices such as digital cameras and digital video cameras. [0003] At present, the traditional packaging method of the image sensor is packaged by wire bonding. Specifically, paste the cut chip on the substrate, and lead out the conductive pad on the chip through the lead wire, and further inject molding on the substrate around the chip to form a supporting side wall with a thickness greater than the thickness of the chip, and cover the supporting side wall a light-transmitti...
Claims
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IPC IPC(8): H01L27/146
CPCH01L27/14683H01L27/14618H01L27/14636H01L27/14643
Inventor 王敬平汪新学
Owner NINGBO SEMICON INT CORP