Substrate treatment apparatus, semiconductor device manufacturing method, and program

Abstract

The present invention is configured to be provided with: a substrate holding tool for holding a variety of multiple substrates including a product substrate and a dummy substrate; a transfer mechanismfor loading the variety of substrates to the substrate holding tool; and a control unit that acquires the number of substrates which can be mounted on the substrate holding tool and the number of product substrates to be mounted on the substrate holding tool, divides the product substrates into multiple substrate groups according to the acquired number of product substrates, divides dummy substrates into multiple substrate groups on the basis of the acquired number of product substrates, the number of substrates that can be mounted on the substrate holding tool, and the number of substrate groups of the product substrates, creates substrate arrangement data used when mounting the product substrates on multiple regions of the substrate holding tool in a dispersed manner, by combining the substrate groups of the product substrate and the substrate groups of the dummy substrates, and causes the transfer mechanism to transfer the variety of substrates to the substrate holding tool according to the created substrate arrangement data.

Description

technical field [0001] The present invention relates to a substrate processing apparatus, a semiconductor device manufacturing method, and a program. Background technique [0002] In a semiconductor manufacturing apparatus as a substrate processing apparatus, in a furnace heated to a predetermined temperature by a heater as a heating mechanism, a boat as a substrate holder loaded with a wafer as a substrate is loaded into the furnace, The furnace is evacuated, the reaction gas is introduced from the reaction gas introduction pipe to process the wafer surface, and the exhaust gas is discharged from the exhaust pipe. In addition, the boat has a plurality of supports, and holds a plurality of wafers horizontally through grooves (hereinafter also referred to as grooves) carved in the supports. [0003] In recent years, the processing of small batches (20 to 100 substrates, for example, 25 or 50 substrates) has become the mainstream. In the case of small batches, as previously ...

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Problems solved by technology

However, in such a case, the gas consumption in the furnace becomes non-uniform, and the difference in film formation between substrates becomes large.

[0004] In addition, as a method of distributing the product substrates on the boat, there is a method of transferring the product substrates with multiple slots, but since the product substrates are transferred one by one, the transfer time will become longer

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