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Brazing connection method of carbon/carbon composite material and metal based on electrophoretically deposited SiC nanowires

A carbon-carbon composite material and electrophoretic deposition technology, which is applied in welding medium, welding equipment, metal processing equipment, etc., can solve the problems of reducing joint strength and achieve the effects of improving joint strength, short cycle time, and reducing residual stress

Active Publication Date: 2020-04-28
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the deficiencies in the prior art, to provide a carbon-carbon composite material and metal brazing connection method based on electrophoretic deposition of SiC nanowires, to solve the problem of using active brazing filler metals to connect C / C composite materials and metals , near the side of the C / C composite material, the continuous brittle compound reduces the strength of the joint. A layer of SiCNWs is deposited on the surface of the C / C composite material, which reacts with the active elements in the solder to form a new phase with a very small scale and precipitates. TiCu uses it as nucleation particles to precipitate in a non-uniform nucleation manner, thereby refining the original continuous brittle TiCu compound, improving the weak phase of the joint, and increasing the strength of the joint

Method used

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  • Brazing connection method of carbon/carbon composite material and metal based on electrophoretically deposited SiC nanowires
  • Brazing connection method of carbon/carbon composite material and metal based on electrophoretically deposited SiC nanowires
  • Brazing connection method of carbon/carbon composite material and metal based on electrophoretically deposited SiC nanowires

Examples

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Embodiment 1

[0026] This example is a control group, which is a brazing connection method between C / C composite material and Nb metal without electrophoretic deposition, using AgCuTi solder, and its nominal composition is Ag-21Cu-4.5Ti wt.%. Specifically follow the steps below:

[0027] (1) Process the C / C composite material to be welded into a small piece of 5mm×5mm×5mm with an internal circle cutting machine, put it in acetone and ultrasonically clean it for 5-30min, and then dry it for later use.

[0028] (2) Process the Nb metal to be welded into a small piece of 10mm×15mm×3mm by wire cutting, polish it to 1000# with SiC sandpaper, put it in acetone for ultrasonic cleaning for 5-30min, and then dry it for later use.

[0029] (3) Assemble the C / C composite material, AgCuTi solder and Nb metal into a brazing piece, put it into a high-temperature vacuum brazing furnace, and wait until the pressure in the furnace is lower than 1×10 -3 MPa, start heating to 750°C at a rate of 10°C / min, the...

Embodiment 2

[0031] This embodiment is a brazing connection method of C / C composite material and Nb metal based on electrophoretic deposition of SiCNWs, using AgCuTi solder, whose nominal composition is Ag-21Cu-4.5Ti wt.%. Specifically follow the steps below:

[0032] (1) Process the C / C composite material to be welded into a small piece of 5mm×5mm×5mm with an internal circle cutting machine, put it in acetone and ultrasonically clean it for 5-30min, and then dry it for later use.

[0033] (2) Process the Nb metal to be welded into a small piece of 10mm×15mm×3mm by wire cutting, polish it to 1000# with SiC sandpaper, put it in acetone for ultrasonic cleaning for 5-30min, and then dry it for later use.

[0034](3) According to concentration SiCNWs0.5g / L, dispersant NNO0.75g / L, AlNO 3 SiCNWs suspension in isopropanol was prepared at 0.05g / L, and ultrasonically dispersed for 1h.

[0035] (4) take the C / C composite material of step (1) gained as the negative pole, the Cu plate is the positiv...

Embodiment 3

[0038] Embodiment 3: The difference between this embodiment and Embodiment 2 is that the electrophoretic deposition time in step (4) is 5s. Others are the same as the second embodiment.

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Abstract

The invention discloses a brazing connection method of a carbon / carbon composite material and metal based on electrophoretically deposited SiC nanowires. According to the method, before connection, alayer of SiCNWs is deposited on the surface of the C / C composite material, the SiCNWs are reacted with active elements in brazing filler metal to generate a new phase with an extremely small size, thenew phase is separated out, and TiCu is separated out in a heterogeneous nucleation mode by taking TiCu as a nucleation mass point, so that an original continuous brittle TiCu compound is refined, aweak phase of a joint is improved, and the strength of the joint is improved. Moreover, compared with chemical vapor deposition, electrophoretic deposition has the advantages of being short in periodand low in cost, and C fibers cannot be damaged.

Description

technical field [0001] The invention relates to the field of welding technology. More specifically, during the brazing process, when a layer of continuous brittle compounds is formed at the connection interface, which affects the joint strength, the method of electrophoretic deposition of SiC nanowires (SiCNWs) can improve the interface structure and increase the joint strength. Background technique [0002] C / C composite materials have the characteristics of low density, high strength at high temperature, excellent ablation resistance and low thermal expansion coefficient, and are often used in aerospace, nuclear power and other fields. In many cases, it is necessary to join C / C composites to metals. At present, among the connection methods between C / C composite materials and metals, the research on brazing connection is relatively extensive. However, due to the large difference in thermal expansion coefficient between the base metal and the brazing joint metal, large res...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/008B23K1/20B23K35/30B23K103/16
CPCB23K1/008B23K1/206B23K35/3006
Inventor 王颖金晨凯杨振文王东坡
Owner TIANJIN UNIV