Porous surface structure, as well as connecting structure and preparing device of base

A technology of surface structure and connection structure, used in welding equipment, manufacturing tools, resistance welding equipment, etc., can solve the problems of low bonding efficiency, high contact heat generation, damage to porous structures, etc.

Pending Publication Date: 2020-05-01
JY MEDICAL DEVICES SHANGHAI CO LTD
View PDF0 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for high-porosity structures, when resistance welding is used to directly connect the porous structure and the substrate, the bonding efficiency is low at this time, resulting in insufficient welding bonding strength or requiring too high a current to achieve sufficient welding strength, The latter causes the contact between the upper electrode and the upper surface of the porous structure to generate too much heat so that the surface of th

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Porous surface structure, as well as connecting structure and preparing device of base
  • Porous surface structure, as well as connecting structure and preparing device of base
  • Porous surface structure, as well as connecting structure and preparing device of base

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0106] like figure 2 As shown, the present invention provides a connecting structure comprising a substrate 23 , an intermediate 22 , and a porous surface structure 21 . Among them, the porous structure of the porous surface structure 21 includes a plurality of staggered supports (or beams), and some multi-directional, regular or irregular pores are formed between the supports (or beams). The intermediate 22 is located between the porous surface structure 21 and the substrate 23 . Optionally, the intermediate body 22 is a non-porous bottom plate, ie a solid bottom plate. Both the porous surface structure 21 and the intermediate body 22 are made of conductive materials (such as metal materials). The porous surface structure 21 and the intermediate body 22 are integrally formed structures, for example, realized by a 3D printing additive manufacturing process, a vapor deposition process, or the like.

[0107] Illustratively, the base 23 is solid, which is beneficial to the ov...

Embodiment 2

[0118] For the above-mentioned first embodiment, the porous surface structure 21 is a structure with a certain porosity, the intermediate body 22 is located between the porous surface structure 21 and the substrate 23 , and the intermediate body 22 is a non-porous bottom plate 22 . Actually, the intermediate 22 can be the solid plate described in the first embodiment, or it can be the porous structure with low porosity described in the second embodiment.

[0119] Therefore, the main difference from the first embodiment is that the connection structure of the second embodiment includes the first porous structure 41 in the high porosity region, the second porous structure 42 in the low porosity region (as an intermediate) and the substrate 43 ,like Figure 4a shown. The second porous structure 42 is located between the first porous structure 41 and the substrate 23 .

[0120] Exemplarily, the porous structures of the first porous structure 41 and the second porous structure 42...

Embodiment 3

[0127] For the above-mentioned first embodiment, the top of the negative electrode 25 is in close contact with the bottom of the substrate 23, and the bottom of the positive electrode 24 is in close contact with the top of the porous surface structure 21; optionally, the positive electrode 24 and the negative electrode 25 are large The planar electrode and the positive electrode 24 cover the top of the porous surface structure 21 , and the negative electrode 25 is covered under the bottom of the substrate 23 . Since the large flat positive electrode 24 of the first embodiment is pressed against the top of the porous surface structure 21, the large flat positive electrode 24 is in contact with the surface of the porous surface structure 21 and is squeezed, so that the surface of the porous surface structure 21 is damaged, for example, due to the surface of the porous surface structure 21. Pressure produces dents and blackening, dents, reduction of pore space, etc. due to tempera...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a porous surface structure, as well as a connecting structure and a preparing device of a base. The porous surface structure is connected with an intermediate in advance to form a complex body; the intermediate is located between the porous surface structure and the base, and is in contact with the base; the base and the complex body are arranged between a first polarity electrode and a second polarity electrode; the first polarity electrode is in electric conduction contact with the porous surface structure and/or the intermediate; the base is in electric conduction contact with the second polarity electrode to form a current loop; and the intermediate is in resistance welding with the base to realize the connection of the complex body and the base. According to the porous surface structure disclosed by the invention, the complex body is tightly connected with the basal plate through an electric resistance welding method, so that the mechanical property of thebase is guaranteed; and the situation that artificial implanting prosthesis has excellent bone implanting performance can be guaranteed, and the intensity of the base is free from substantive influence.

Description

technical field [0001] The invention relates to the connection technology of mechanical structures, in particular to medical instruments, and provides a connection structure and a preparation device for preparing a porous surface structure and a substrate. Background technique [0002] Engineering applications often have different requirements for the overall and surface properties of mechanical structures. For example, the overall performance (such as fatigue strength) of the acetabular cup and femoral stem of the artificial hip joint should meet the dynamic load that the prosthesis will bear when it is implanted in the body, with an average of one million to two million walks per year. It also has specific performance requirements for the surface of the prosthesis to ensure that the surface of the prosthesis is firmly combined with the patient's bone group to ensure that the prosthesis does not loosen; otherwise, the patient will have pain, and the prosthesis must be remov...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): A61F2/32A61F2/34A61F2/36A61F2/38B23K11/00
CPCA61F2/32A61F2/34A61F2/3662A61F2/38A61F2/3859A61F2/389B23K11/00
Inventor 姚建清史金虎朱永良
Owner JY MEDICAL DEVICES SHANGHAI CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap