Pretreatment process for metal electroplating wastewater and treatment device thereof

Abstract

The invention discloses a pretreatment process for metal electroplating wastewater and a treatment device thereof. Key points of a technical scheme of the invention are as follows: the treatment device comprises an outer groove body, a water inlet and a water outlet, wherein the water inlet is arranged at the lower end of the side surface of the outer groove body; the water outlet is arranged at the upper end of the side surface of the outer groove body; the outer groove body comprises a reaction treatment cavity, a sludge discharging cavity arranged at the lower end of the reaction treatmentcavity, and a dross collection cavity arranged at one side of the reaction treatment cavity; at least one pair of centrosymmetric electrode plates is arranged in the reaction treatment cavity; the electrode plates comprise cathodes which are symmetrically inclined and anodes which are arranged at the inner sides of the cathodes in parallel; the bottom part of a channel between the anodes and the cathodes communicates with the sludge discharging cavity; a perforated water distribution pipe is arranged between the centrosymmetric anodes in a matched mode; and the lower end of the perforated water distribution pipe is connected with a water inlet pipeline which penetrates through the water inlet. According to the invention, an electric flocculation process and device with a strong oxidation function are used as a front end of electroplating wastewater treatment for pretreatment, so the concentration of pollutants in wastewater can be effectively reduced; meanwhile, a majority of metal elements are recycled; and generation of precipitates is reduced.

Description

technical field [0001] The invention relates to the field of environmental protection wastewater treatment, and relates to a pretreatment process for metal electroplating wastewater and a treatment device thereof. Background technique [0002] Electroplating has always been considered a heavily polluting industry, which is directly related to the high pollution and difficult treatment of electroplating wastewater discharged, especially when products change and requirements increase. In the electroplating process, in order to improve the quality of electroplating or to promote the co-precipitation of various elements, a wide variety of organic and inorganic additives and complexing agents enter the electroplating process, with inorganic substances (CN-, PO43-, NH4+) and organic acids, Organic amines and organic phosphorus exist in process wastewater, which brings great pressure to subsequent wastewater treatment: 1) For biochemical methods, electroplating wastewater contains ...

AI Technical Summary

Problems solved by technology

In the electroplating process, in order to improve the quality of electroplating or to promote the co-precipitation of various elements, a wide variety of organic and inorganic additives and complexing agents enter the electroplating process, with inorganic substances (CN-, PO43-, NH4+) and organic acids, Organic amines and organic phosphorus exist in process wastewater, which brings great pressure to subsequent wastewater treatment: 1) For biochemical methods, electroplating wastewater contains toxic substances that are difficult to degrade, which greatly restricts microbial The type and normal metabolic process, while the electroplating wastewater lacks the organic carbon required by microorganisms and the nutritional components are unbalanced, making it difficult for biochemical methods to efficiently and stably treat electroplating wastewater; 2) Chemical precipitation method, which is efficient and targeted The strong feature is that many electroplating wastewater treatment methods are used in the industry, but the control requirements for the unit are relatively high, and a large amount of chemicals need to be added for precipitation, resulting in increased operating costs and a large amount of solid waste.

When additives and complexing agents are added to the electroplating mother solution, these additives will form complexes with metal ions, which will affect the precipitation process and weaken the effect of chemical precipitation.

Images