Vertical electroplating equipment

Abstract

The invention discloses vertical electroplating equipment. The vertical electroplating equipment structurally comprises an electroplating machine, lifting handles, a roll barrel water filtering bracket, a filter, an electric cabinet and an anode bar; the electroplating machine is composed of a vertical case, a movable installation frame, a cleaning hairbrush, an electroplating device, a cathode copper fork and an electroplating bath, the electroplating machine utilizes the motor to drive an electroplating roll barrel to rotate through a motor shaft, the electroplating roll barrel can enable small-size workpieces to be orderly constrained on the inner wall of the electroplating roll barrel through hardware fitting inserting strips, and the situation that the workpieces fall out of an electroplating fixture, and thus, the workpieces are damaged is prevented; a filtering inner barrel enables an electroplating solution to be filtered and permeate onto the surfaces of the workpieces througha filtering net under the hardware fitting inserting strips, and the electroplating efficiency is improved; and the electroplating roll barrel conducts flat scanning electroplating on the workpiecesin the hardware fitting inserting strips through a flat scanning mechanism, and the quality of electroplating layers of the workpieces is improved.

Description

technical field [0001] The invention relates to the field of metal electroplating, in particular to a vertical electroplating equipment. Background technique [0002] Electroplating is the process of plating a thin layer of other metals or alloys on some metal surfaces by using the principle of electrolysis. According to the actual needs of electroplating, different electroplating solutions and electroplating equipment will be selected. Vertical electroplating equipment is one of the commonly used electroplating equipment. It is mainly used for electroplating operations of wafers. When the workpiece to be electroplated is very small, it may cause the wafer to leak out of the electroplating fixture, resulting in damage to the wafer, and the use of vibration to electroplate the wafer may lead to uneven electroplating of the wafer, which directly affects the overall electroplating efficiency and coating quality. Finally, when the parts need to be taken out, the parts need to b...

AI Technical Summary

Problems solved by technology

When the workpiece to be electroplated is very small, it may cause the wafer to leak out of the electroplating fixture, resulting in damage to the wafer, and the use of vibration to electroplate the wafer may lead to uneven electroplating of the wafer, which directly affects the overall electroplating efficiency and coating quality. Finally, when the parts need to be taken out, the parts need to be fished out, which is inconvenient to take out, increases the processing time and reduces the processing efficiency

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