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High-speed die punching pin assembly for punching LTCC raw ceramic chip for electronic product and machining process of high-speed die punching pin assembly

A technology of electronic products and processing technology, applied in the field of microelectronics, to achieve the effect of improving the efficiency of punching, high structural strength and high processing accuracy

Inactive Publication Date: 2020-05-08
PRECISION RONG CREATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems existing in the prior art, the present invention provides a high-speed die-punching needle assembly and its processing technology for punching holes in LTCC green ceramic sheets for electronic products. Fast speed, more than 5000 holes per minute, less likely to be interrupted

Method used

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  • High-speed die punching pin assembly for punching LTCC raw ceramic chip for electronic product and machining process of high-speed die punching pin assembly
  • High-speed die punching pin assembly for punching LTCC raw ceramic chip for electronic product and machining process of high-speed die punching pin assembly
  • High-speed die punching pin assembly for punching LTCC raw ceramic chip for electronic product and machining process of high-speed die punching pin assembly

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Embodiment

[0040] Such as Figure 1-Figure 3 As shown, a high-speed punching pin assembly for punching holes with LTCC green ceramic sheets for electronic products includes a high-speed punching pin 1 and a high-speed lower die 2, and the high-speed punching pin 1 includes a cylindrical punching body 110 and The cylindrical needle head 120 and the fixed block 130 respectively arranged at both ends of the punching needle body 110, the length ratio of the punching needle body 110 and the needle head 120 is 2:0.3; the punching needle body 110 of the high-speed die punching needle 1 The upper sleeve is provided with a tubular high-speed mold shaft sleeve 3; the lower mold 2 of the high-speed mold is cylindrical, and an accommodation groove 210 is provided on one end surface of the lower mold 2 of the high-speed mold, and the groove bottom of the accommodation groove 210 is provided with a connecting To the through hole 220 of the other end face of the high-speed die lower die 2 for the needl...

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Abstract

The invention discloses a high-speed die punching pin assembly for punching an LTCC raw ceramic chip for an electronic product. The high-speed die punching pin assembly comprises a high-speed die punch pin and a high-speed die lower die, the high-speed die punch pin comprises a cylindrical punch pin body, and a cylindrical pin head and a cylindrical fixing block which are respectively arranged attwo ends of the punch pin body, the length ratio of the punching needle body to the needle head is 2: 0.3, a tubular high-speed die shaft sleeve is sleeved on a punching needle body of the high-speeddie punching needle, the high-speed die lower die is cylindrical, a containing groove is formed in one end face of the high-speed die lower die, and a through hole which is communicated to the other end face of the high-speed die lower die and allows a needle head of a high-speed die punching needle to penetrate through is formed in the bottom of the containing groove. The punching needle is highin machining precision, high in strength, high in punching speed and not prone to breakage.

Description

technical field [0001] The invention relates to LTCC (low temperature co-fired ceramic technology) in the field of microelectronics, in particular to a high-speed punching needle assembly for punching holes in LTCC green ceramic chips for electronic products and its processing technology. Background technique [0002] LTCC technology is a new material technology developed by Hughes Company in 1982. It is made of low-temperature sintered ceramic powder into a green ceramic belt with precise thickness and density. Laser, punching needle drilling, microporous grouting, The required circuit pattern is produced by precision conductor paste printing and other processes, and multiple passive components (such as low-capacity capacitors, resistors, filters, impedance converters, couplers, etc.) are embedded in the multilayer ceramic substrate, and then stacked. Pressed together, the inner and outer electrodes can be made of silver, copper, gold and other metals, and sintered at 900 ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D1/14B28D7/00
CPCB28D1/146B28D7/00
Inventor 杨强雍艳
Owner PRECISION RONG CREATION TECH CO LTD
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