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Micro-channel radiator design method based on active phased-array antenna heat dissipation

A phased array antenna and design method technology, applied in design optimization/simulation, computer-aided design, calculation, etc., can solve the problems that microchannel radiators cannot meet the heat dissipation requirements of high heat density chips, so as to improve the heat dissipation effect and overcome The effect of large temperature difference on the heat source surface, good heat dissipation and temperature uniformity

Active Publication Date: 2020-05-08
XIDIAN UNIV
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Problems solved by technology

However, in this method, the power of each heat source is 0.9W, and the heat flux is 56.25W / cm 2 , the microchannel heat sink designed by this method still cannot meet the heat dissipation requirements of high heat density chips

Method used

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  • Micro-channel radiator design method based on active phased-array antenna heat dissipation
  • Micro-channel radiator design method based on active phased-array antenna heat dissipation
  • Micro-channel radiator design method based on active phased-array antenna heat dissipation

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Embodiment 1

[0038] refer to figure 1 , figure 2 with image 3

[0039] A method for designing a microfluidic heat sink based on active phased array antenna cooling, characterized in that it comprises the following steps:

[0040] According to the working frequency point of the active phased array antenna, the structure and power of the power amplifier unit, determine the position distribution of the power amplifier unit;

[0041] According to the structure and position distribution of the power amplifier unit, determine the heat source and micro-channel structure;

[0042] According to the design of the micro-channel heat sink and the LTCC process requirements, determine the channel position D f , runner thickness H f and runner width W f , to obtain microchannel models with different structures;

[0043] Import the microchannel models of different structures into Icepak, add the fan model and heat source model in Icepak, and add the P-Q curve of the microflow pump in the fan mode...

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Abstract

The invention discloses a design method of a micro-channel radiator based on active phased-array antenna heat dissipation. The method comprises the following steps: determining the position distribution of a power amplifier unit according to the working frequency point of an active phased-array antenna and the structure and power of the power amplifier unit; combining the design of a micro-channelradiator with LTCC process requirements, thereby determining the channel position Df, the channel thickness Hf and the channel width Wf, and acquiring micro-channel models with different structures;carrying out joint simulation on the micro-channel models with different structures and a micro-flow pump to determine an optimal micro-channel model; optimizing the optimal micro-channel model to determine a heat dissipation layer channel and an adjustment layer channel structure; forming metal through holes, performing heat dissipation simulation is carried out, and then optimizing the added metal through holes until the heat dissipation requirement of the chip is satisfied. The obtained micro-channel radiator has good heat dissipation performance and temperature uniformity, and can meet theheat dissipation requirement of a high-heat-density active phased-array antenna.

Description

technical field [0001] The invention belongs to the technical field of micro-channel heat dissipation, and in particular relates to a design method of a micro-channel heat sink based on active phased array antenna heat dissipation, which can be applied to improve the heat dissipation and heat source surface uniformity of microelectronic products. Background technique [0002] The micro-channel heat sink adopts a water-cooling method, and uses the fluid to flow through the micro-channel embedded in the substrate and below the heat-generating chip to transfer the heat of the chip to the outside of the substrate, and dissipate heat through the external heat exchange system to reduce the heat-generating chip. temperature purpose. [0003] With the rapid development of microelectronics and semiconductor technology, the integration level of integrated circuit chips is also increasing, which also leads to high heat flux density in chips. The sharp increase of heat flux will seriou...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F30/20G06F119/08
CPCY02E60/00
Inventor 董刚董婷妮杨银堂
Owner XIDIAN UNIV
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