SiC insulated gate bipolar transistor with NiO/SiC pn heterojunction
A bipolar transistor and insulated gate technology, which is applied in semiconductor devices, semiconductor/solid-state device manufacturing, electrical components, etc., can solve the problems of poor conductance modulation effect in the drift region, high forward turn-on voltage, and large on-state resistance. Achieve the effects of excellent n-drift zone conductance modulation, low forward turn-on voltage, and low on-state power consumption
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[0051] In the following, a 20kV 4H-SiC n-IGBT with NiO / SiC pn heterojunction is taken as an example to further describe the device of the present invention in detail.
[0052] The device structure of this embodiment is as figure 1 As shown, it includes the p-NiO layer 1, and the n-SiC buffer layer 2, the n-SiC drift region 3, the p-SiC well region 4 on the upper surface of the p-NiO layer 1, the p-SiC ohmic contact region 5, the n- SiC emitter 6, gate insulating dielectric film 7, gate 8, emitter 9, collector 10, insulating passivation dielectric film 11, and metal 12.
[0053] The preparation method of the 20kV 4H-SiC n-IGBT with NiO / SiC pn heterojunction of this embodiment is specifically implemented according to the following steps:
[0054] Step 1. Use low pressure hot wall chemical vapor deposition to make n-SiC buffer layer 2 on a 4H-SiC material substrate. The thickness of the 4H-SiC substrate is 300 μm, the doping type is n-type, and the doping concentration is 2×10 18 cm -3...
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