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A balanced-unbalanced conversion device, communication device and communication system

A technology for conversion devices and communication devices, applied in the direction of reducing unbalanced current interference, connection devices, waveguide devices, etc., can solve the problems of large space occupation and unfavorable wiring, etc., and achieve good electrical performance, flexible winding, and high density. Effect

Active Publication Date: 2021-05-07
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The balanced-unbalanced conversion device, communication device and communication system provided by the embodiments of the present application solve the problem that the balanced-unbalanced conversion device in the prior art is not conducive to wiring and occupies a large space

Method used

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  • A balanced-unbalanced conversion device, communication device and communication system
  • A balanced-unbalanced conversion device, communication device and communication system
  • A balanced-unbalanced conversion device, communication device and communication system

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Embodiment Construction

[0092] The embodiments of the present application relate to baluns, communication devices, and communication systems. The concepts involved in the above embodiments are briefly described below:

[0093] A balun, also known as a balun, is used to convert a balanced signal to an unbalanced signal or an unbalanced signal to a balanced signal.

[0094] Impedance, in a circuit with resistance, inductance and capacitance, the hindrance to the current in the circuit is called impedance.

[0095] Such as figure 2 As shown, the embodiment of the present application provides a balanced-unbalanced conversion device, including an insulating substrate 1, a first microstrip line 2, a second microstrip line 3 and a conductive ground 4, such as image 3 As shown, the first microstrip line 2 includes a first balanced signal connection section 21, a first impedance matching section 22, and an unbalanced signal connection section 23 connected in sequence, and the first balanced signal connecti...

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PUM

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Abstract

Embodiments of the present application provide a balanced-unbalanced conversion device, a communication device, and a communication system, which relate to the technical field of communication equipment. The balanced-unbalanced conversion device includes an insulating substrate, a first microstrip line, a second microstrip line, and a conductive ground. The first microstrip line includes a first balanced signal connection section, a first impedance matching section and an unbalanced signal connection section, the first balanced signal connection section is used to transmit the first component of the balanced signal, and the unbalanced signal connection section is used to transmit the unbalanced signal connection section. Balanced signal; the second microstrip line includes a second balanced signal connection section, a second impedance matching section and a ground section, the second balanced signal connection section is used to transmit the second component of the balanced signal, and the ground section is used to connect the ground signal. The first microstrip line, the second microstrip line and the conductive ground are all arranged on the insulating substrate, and at least a part of the first microstrip line and / or at least a part of the second microstrip line have a gradual cross-sectional area.

Description

technical field [0001] The present application relates to the technical field of communication equipment, and in particular to a balanced-unbalanced conversion device, a communication device and a communication system. Background technique [0002] In current data communication equipment, differential signal lines are used for electrical interconnection. The reason why the differential signal line is used is because the high-speed serializer / deserializer (Serializer / Deserializer, serdes) of the chip is a differential signal interface, so that the differential signal pair comes from the power supply when the chip performs on-chip signal processing and package wiring. Mode noise has better immunity. However, the high-speed communication system of the backplane / inter-chassis / rack usually uses a biaxial transmission line for signal transmission, but the following problems exist in the use of a biaxial transmission line: the biaxial transmission line includes two signal lines an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P5/10H04B3/54
CPCH01P5/10H04B3/54H04B3/30H01P3/026H01P3/081H01P3/08H03H7/42
Inventor 臧大军王翠翠莫道春陆玉春王临春
Owner HUAWEI TECH CO LTD
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