Interconnection Design Method and Interconnection Equipment of Microwave Substrate and Coaxial Connector
A coaxial connector, microwave substrate technology, applied in the direction of assembling printed circuits with electrical components, can solve the problems of low threshold voltage and low current density, and achieve the effect of reducing dielectric loss and improving transmission characteristics
Active Publication Date: 2021-08-31
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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[0004] In view of this, the embodiment of the present invention provides a microwave substrate and coaxial connector interconnection design method to solve the problem of low threshold voltage and low current density of the microwave substrate and coaxial connector interconnection design method realized in the prior art. question
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[0022] In the following description, specific details such as specific system structures, techniques such as specific system structures, and techniques are proposed for explanation of specific details such as specific system structures, and techniques. However, it will be apparent to those skilled in the art that the present application can be implemented in other embodiments without these specific details. In other cases, detailed description of well-known systems, devices, circuits, and methods is omitted to prevent unnecessary details to prevent the presentation.
[0023] In order to illustrate the technical solution of the present invention, the following will be described below.
[0024] figure 1 It is a schematic flow diagram of a microwave substrate and a coaxial connector interconnection design method according to an embodiment of the present invention, and is only shown in order to facilitate explanation, only a portion related to the embodiment of the present invention ...
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The present invention is applicable to the field of semiconductor technology, and discloses a microwave substrate and coaxial connector interconnection design method and interconnection equipment. The method includes: performing groove processing on the first preset position of the initial substrate structure to obtain the first substrate structure, The initial substrate structure includes at least two layers of microwave substrates. The first substrate structure only retains the top microwave substrate, the first microwave substrate, and the first dielectric layer between the top microwave substrate and the first microwave substrate at the first preset position. The first microwave The substrate is a microwave substrate adjacent to the microwave substrate on the top layer, and a transition through hole is provided in the first dielectric layer; a coaxial connector is connected to the first microwave substrate reserved at the first preset position of the first substrate structure, so that the coaxial The microwave signal transmitted by the connector is transmitted from the first microwave substrate to the device installed on the top microwave substrate through the transition through hole. The invention can effectively improve the transmission characteristics and reduce the dielectric loss without affecting the circuit part of the multilayer substrate and the installation of devices.
Description
Technical field [0001] The invention belongs to the semiconductor technology, and more particularly to a microwave substrate and a coaxial connector interconnection design method and an interconnect device. Background technique [0002] At present, the microwave substrate is widely favored by microwave designers with its high integration and easy process assembly. The microwave substrate is used to interconnect the microwave signal by interconnection with the high frequency coaxial connector. [0003] At present, the interconnection of the coaxial connector and the microwave substrate is achieved by a wire radio frequency insulator (i.e., the metal inner conductor) on the coaxial connector and the tape line directly interconnected on the top of the microwave substrate. However, due to the increasing product complexity and integration, the number of layers of the microwave substrate is increasing, and the combination of multi-layer microwave substrates often uses different materia...
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IPC IPC(8): H05K3/34
CPCH05K3/34
Inventor 张金明孙建才黄从喜张辉郭建杜伟李新勇郭立涛曹欢欢叶云彪
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP