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Curable granular silicone composition, cured object obtained therefrom, and production method therefor

A silicone composition and hardening technology, applied in the direction of semiconductor/solid-state device parts, electric solid-state devices, semiconductor devices, etc., can solve difficult application, difficult to mold composition, difficult to achieve hardenability/rapid hardening, etc. problems, to achieve the effect of high-efficiency manufacturing, excellent color resistance, excellent workability and hardening characteristics

Active Publication Date: 2020-05-12
DOW TORAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, this composition needs to remove the organic solvent in the process of making a sheet, and in order to avoid residual solvent, it can only be used as a thin film sheet, so it is difficult to use it as a molding composition
Also, since heat is applied in the solvent removal process, it is difficult to achieve faster hardening / rapid hardening required in the molding process
Therefore, it is difficult to apply the composition disclosed in Patent Document 3 to solve the above-mentioned problems.
[0006] In addition, Patent Document 4 discloses curable silicone particles for molding using a methyl silicone resin, but since the production of this composition requires melt-kneading at high temperature, it is difficult to control the hardening of the composition. properties, it is difficult to achieve short-time molding at low temperature

Method used

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  • Curable granular silicone composition, cured object obtained therefrom, and production method therefor

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Experimental program
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Embodiment

[0144] The curable granular silicone composition of this invention, its manufacturing method, and the processing method of an inorganic filler are demonstrated in detail using an Example and a comparative example. In addition, in the formula, Me, Ph, and Vi represent a methyl group, a phenyl group, and a vinyl group, respectively. Furthermore, with regard to the curable silicone compositions of the respective examples and comparative examples, the pasting properties, melt viscosity, moldability, and spectral reflectance were measured by the following methods. Then, the cured product was produced by heating the curable granular silicone composition at 150°C for 2 hours, and the spectral reflectance, hardness, and bending strength immediately after curing / after the heat resistance test were measured by the following methods. The results are shown in Table 1.

[0145] [Tablet-beating property]

[0146] The tabletability of the tablet was confirmed by compression-molding the cur...

reference example 1

[0155] In a 1L flask, put it in the form of a white solid at 25°C, with an average unit formula:

[0156] (Me 2 ViSiO 1 / 2 ) 0.09 (Me 3 SiO 1 / 2 ) 0.43 (SiO 4 / 2 ) 0.48 (HO 1 / 2 ) 0.03

[0157] 270.5 g of a 55% by mass-xylene solution of the indicated organopolysiloxane resin and 1,3-divinyltetramethyldisiloxane complex of platinum Disiloxane solution (platinum metal content = about 4000ppm) 0.034g, uniformly stirred at room temperature (25°C) to prepare organopolysiloxane resin (1) containing 10ppm platinum metal in xylene solution. Furthermore, this organopolysiloxane resin (1) does not soften / melt even when heated, and does not have thermal fusibility.

reference example 2

[0159] In a 1L flask, put it in the form of a white solid at 25°C, with an average unit formula:

[0160] (Me 2 ViSiO 1 / 2 ) 0.05 (Me 3 SiO 1 / 2 ) 0.39 (SiO 4 / 2 ) 0.56 (HO 1 / 2 ) 0.02

[0161] 270.5 g of a 55% by mass-xylene solution of the indicated organopolysiloxane resin and 1,3-divinyltetramethyldisiloxane complex of platinum Disiloxane solution (platinum metal content = about 4000ppm) 0.034g was uniformly stirred at room temperature (25°C) to prepare organopolysiloxane resin (2) containing 10ppm platinum metal in xylene solution. Furthermore, this organopolysiloxane resin (2) does not soften / melt even when heated, and does not have thermal fusibility.

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Abstract

To provide a curable granular silicone composition which has hot-melt properties, is excellent in terms of handleability and curability in overmolding, etc., and gives cured objects and the like highly inhibited from taking a color at high temperatures. A curable granular silicone composition characterized by comprising (A) fine particles of an organopolysiloxane resin which does not have hot-meltproperties and has a curing-reactive functional group containing a carbon-carbon double bond and in which siloxane units represented by RSiO3 / 2 (R is a monovalent organic group) or SiO4 / 2 account forat least 20 mol% of all the siloxane units, (B) a liquid, linear or branched organopolysiloxane having, in the molecule, at least two curing-reactive functional groups containing a carbon-carbon double bond, (C) a hardener, and (D) a functional filler, the composition as a whole having hot-melt properties; and uses of the curable granular silicone composition.

Description

technical field [0001] The present invention relates to a curable granular silicone composition and its molded products (granules, sheets, etc.), which can be obtained by a simple production method and are excellent in heat-meltability / moldability and high-temperature coloring resistance of the cured product. ) and their hardened counterparts. Furthermore, the present invention relates to a cured product of the composition and uses thereof (particularly, members for semiconductors including reflective materials and optical semiconductors having the cured product), a method for producing the composition, a method for molding the cured product, and the like. Background technique [0002] The curable silicone composition can be cured to form a cured product having excellent heat resistance, cold resistance, electrical insulation, weather resistance, water repellency, and transparency, and thus is used in a wide range of industrial fields. The cured product of such a curable si...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08K5/14C08L83/05H01L23/29H01L23/31
CPCC08K5/14C08L83/04C08G77/12C08G77/20H01L23/296H01L2933/0091H01L33/501C08K5/56C08L83/00C08K3/36C08K3/011C08K3/013C08K3/22C08L83/02B29C35/02C08L2205/025B29C45/0001B29K2083/00B29K2105/0005C08L2205/03H01L33/56H01L33/60H10K85/40
Inventor 山崎亮介今泉彻尾崎弘一
Owner DOW TORAY CO LTD
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