Unlock instant, AI-driven research and patent intelligence for your innovation.

Processing head, processing system, and method of processing a localized surface area of ​​a substrate

A surface area, processing head technology, applied in the field of processing head, can solve the problems of reduced output, poor imprint quality, low yield rate, etc.

Active Publication Date: 2022-05-06
SUSS MICROTEC PHOTOMASK EQUIP GMBH & CO KG
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Also, if the stencil has any form of defects such as resist residues, stains, particles, surface scratches, chipping, bumps, etc., it may result in poor imprint quality, low yield, and reduced throughput

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Processing head, processing system, and method of processing a localized surface area of ​​a substrate
  • Processing head, processing system, and method of processing a localized surface area of ​​a substrate
  • Processing head, processing system, and method of processing a localized surface area of ​​a substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] For illustrative purposes, embodiments of the present invention will be described as applied to the cleaning of templates for lithography, and in particular, the cleaning of the mesa regions of templates for nanoimprint lithography, although it is obvious that Yes, embodiments of the present invention are also applicable to cleaning different substrates or other plasma treatments for substrate surfaces, such as surface passivation or other processes that partially use plasma to modify surface properties. The mesa region of a template used for nanoimprint lithography is the region in direct contact with the resist, and resist particles may adhere to this region, which may compromise the functionality of the template. Such resist particles are considered as contaminants which should be removed during the cleaning process without damaging the fine structure of the mesa area.

[0038] As used herein, directional phrases relate to the orientation of components shown in the d...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a processing head for processing a surface area of ​​a substrate comprising a housing, a discharge opening, a radiant heater, a plasma source and an outlet opening. The housing has a main surface configured to be disposed adjacent to and facing the surface area of ​​the substrate to be processed. The discharge opening is located in the main surface of the housing and is connectable to the discharge device via a discharge gas path at least partially formed in the housing. A radiant heater is disposed in the housing to emit heat radiation through the radiation opening in the main surface. A plasma source is disposed in the housing to emit a plasma jet through a plasma exit opening in the main surface. An outlet opening is located in the main surface of the housing and is connectable to the gas source via a gas path at least partially formed in the housing. The center of the discharge opening, the center of the radiation opening, the center of the plasma exit opening and the center of the outlet opening are arranged in the above order along the first direction of the main surface.

Description

technical field [0001] The present invention relates to a processing head, a processing system and a method of treating a localized surface area of ​​a substrate using plasma. The present invention refers to a preferred process for removing contaminants from a substrate. [0002] The processing head, the processing system and the processing method are particularly suitable for removing contaminants from templates used in nanoimprint lithography, but may also be used in other techniques requiring plasma processing in a controlled environment. Background technique [0003] Nanoimprint lithography is a well-known technique for producing nanoscale relief patterns using patterned templates, also known as masks or molds. The template is used to imprint the pattern into a suitable material, such as liquid resist. The material can then be cured while the material is still in contact with the template, after which the template is removed. Particles may adhere to the template surfa...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20H01L21/02B05B1/04
CPCG03F7/0002B08B15/04H05H1/24H05H2245/40G03F7/70925B08B5/023B08B7/0071H01J37/00H05H1/46B08B2205/005B08B7/00G03F1/82
Inventor 伍威·戴兹马丁·萨玛约亚
Owner SUSS MICROTEC PHOTOMASK EQUIP GMBH & CO KG